The MPM® Momentum® Compact printer delivers best-in-class performance and cutting-edge printing in an unexpectedly small package. Designed to meet the challenges of finer pitch PCB applications, the Momentum Compact is ideal for easy line setup with tight floor space requirements.
Momentum Compact Printer
The MPM Compact delivers the highest throughput for its footprint in the industry. At 30% smaller overall than the Momentum®, the Momentum Compact can be configured for dual lane and back-to-back processing to fit more lines in a given footprint, at Momentum throughput speeds.
With its higher accuracy, Momentum® processing speeds, and optional EnclosedFlow print head for fine-feature printing excellence, the MPM Momentum Compact delivers higher yields with fewer print defects, for a faster ROI.
Momentum Compact delivers a remarkable wet print accuracy of 18µ @ 6σ, Cpk>2 for superb fine feature printing performance!
Less waste and higher yields boost profitability and a robust, repeatable process. Greater efficiency with the Momentum C supports ‘green’ and sustainable manufacturing initiatives with a Lower Cost of Ownership.
Configured stand-alone or in-line, the Momentum Compact’s design is ideal for back-to-back processing, which is growing in popularity as the new optimal configuration for dual lane layouts. The Momentum Compact is also available with optional shuttle conveyors to transport PCBs downstream.
The Momentum Compact’s welded rigid steel frame provides the foundation for many years of reliability and repeatability. Precision ball screws along with a decoupled work nest and camera gantry provide the basis for its best in class accuracy, exceptional motion stability, and reduced alignment time.
Easy to learn and use for the average operator, Speedline’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy.
The EnclosedFlow print head delivers superior volume/yield on fine pitch pads. Print fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than squeegee blades! EnclosedFlow ensures optimal aperture filling for fine pitch devices and crisp uniform printing with less waste.
EdgeLoc™ firmly holds the PCB in place without the use of top clamps. Software-controlled pressure optimizes holding force and automatically adapts to the programmed board thickness. EdgeLoc delivers optimal stencil to board gasketing for higher paste release efficiency and less cleaning requirement.
RapidClean is MPM’s high-speed stencil cleaning solution that improves cleaning performance and cuts cycle time. RapidClean provides precise wet-dry wipe transition and exceptional cleaning results with its paper over plenum design, venture vacuum, and patented roller solvent bar delivery system.
The MPM Paste Height Monitor is a robust solution that allows the user to monitor the paste roll size on the front squeegee blade during a print stroke.
MPM’s PrinTrack adds traceability, data harvesting, and reporting to your printing process. With PrinTrack, you always have an easily-accessible, comprehensive history detailing how your product was printed, when it was made, the process parameters used to print it, and all pertinent information that can be used to track products or troubleshoot the process if needed. A flexible Web reporting interface can be user-configured to produce traceability reports. PrinTrack is a portal to the Industry 4.0 evolution; it features open architecture for seamless integration, a standard method of connecting to MES and ERP systems, and its open architecture makes it highly compatible and expandable to factory-wide Track, Trace, and Control systems.
The SPI Print Optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and θ registration ‘on the fly’ to stay on target and prevent print defects.
MPM’s Open Apps feature is an open architecture source code which provides customers and third parties the capability of developing custom interfaces in support of Industry 4.0 initiatives and Manufacturing Execution Systems (MES).