Camalot Dispensers Technical Papers

Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies

Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies

Over the past ten years, there has been an exponential growth in innovations and designs to offer cutting edge electronic devices that are smaller, faster, with advanced features built in.

The existence of smartphones, wearable devices, tablets, etc., is the evidence of these advancements. Original equipment manufacturers are looking for processes in electronic assemblies that can offer high-speed, high accuracy, and fine droplet mass deposition to address the challenges of product miniaturization, high-density component packaging, and complex designs.

Dispensing: A Robust Process Solution for Shield Edge Interconnect

Dispensing: A Robust Process Solution for Shield Edge Interconnect

A new process has been developed for RF shielding on compact electronic communications devices using automated solder paste dispensing. The process is known as Shield Edge Interconnect (SEI). SEI designs enable parts to be processed though underfill before placing of the RF shield and allows more complete use of valuable PCB real estate to achieve reduced form factor requirements and/or for added components on products such as smartphones and tablets.