Speedline Launches MPM® Edison Next Generation Printer Platform

Thursday, October 22, 2015

Franklin, Massachusetts, USA – Speedline Technologies announces the introduction of MPM Edison, the next generation in printing technology. Edison is an innovative new platform of next-generation printers sharing software, controls, and advanced technologies on a scalable platform. Featuring outstanding speed, accuracy, and performance surpassing best-in-class SMT printers worldwide, Edison is built to excel in every way, with patented features throughout its design. Edison operates at twice the speed and 25% higher accuracy than current printers, achieved by Speedline engineers re-thinking the printing machine from top to bottom.  

Edison delivers an unheard-of higher throughput than competitive printers –15 seconds total throughput, including stencil wipe cycle.  That’s due in part to an all new highly-efficient parallel processing stencil shuttle system, wiper, vision gantry, and other cycle time reduction and innovations so that Edison delivers double the throughput of best-in-class printers worldwide.

Edison features unbeatable accuracy. Edison has built-in 8 micron alignment, and 15 micron wet print repeatability (>2 Cpk @ 6σ) proven through 3rd party Print Capability Analysis (PCA) testing. This represents a 25% improvement in wet print accuracy over current best-in-class printing machines.

Edison performs superbly with SMT Fine Pitch solder paste printing for small apertures (<.3mm CSP’s, 01005’s), and Edison is powered by an intuitive, new software operating system, Intueri, that’s easy to set up and use. Intueri features Speedline’s Open Apps Interface (OAI), a revolutionary new ‘open architecture’ machine communications and control system enabling customers to develop their own apps while directly integrating with their MES for unheard-of levels of process optimization and integration, anticipating Industry 4.0 goals.

Edison’s ‘smart’ operation requires less operator intervention, and can be configured back-to-back to create a dual lane processing solution without increasing line length. Edison features a compact footprint and low cost of ownership. Other significantly improved features include EdgeLoc and a Foil Clamp system, plus an all new parallel processing stencil shuttle system, wiper, vision gantry, squeegee head, and improved serviceability of motors and sensors.

MPM Edison will be exhibited at Productronica 2015 in Munich, Germany, November 10 – 13, 2015, in Hall A4, Booth 554, with other Speedline products as well as products and new technologies presented by other members of the ITW Electronics Assembly Equipment Group, of which Speedline Technologies is a member.

 

About Speedline Technologies

Speedline Technologies, a member of the ITW Electronics Assembly Equipment Group (Illinois Tool Works, Inc. (NYSE: ITW), is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. Based in Franklin, Massachusetts, USA, with Electrovert manufacturing based in Camdenton, Missouri, the company markets four best-in-class brands: MPM stencil and screen printing systems; Camalot dispensing systems; Electrovert wave soldering, reflow soldering and cleaning equipment; and Accel microelectronics cleaning equipment. For more information about Speedline Technologies visit www.speedlinetech.com.