Webinar - Selective considerations between dip process and point to point - Pros/Cons

Description - Selective soldering is a process commonly used for through-hole technology (THT) components on printed circuit boards (PCBs). The machine solders THT components without affecting nearby surface mount components. The through put (soldered PCBs per hour) is important in selecting the solder method. Two technologies that are available are dip soldering (ZEVAv) or point-to-point soldering (ZEVAm). The dip soldering is faster, and the point-to-point soldering is more flexible. Both processes are discussed showing the benefits and challenges.

Presenter bio - Gerjan Diepstraten

Advanced Technology Manager at Vitronics Soltec, an ITW company. Responsible for soldering processes and new technology developments with over 30 years’ experience. Six Sigma Black Belt trained at University of Amsterdam. Learned about solder materials when working for Cobar Europe B.V. Received a 'Honorable Mention’ for IPC Technical Conference Paper presented at APEX Expo, Las Vegas 2009.
Published over 50 articles in technical magazines and is an IPC-A-610 Certified Trainer.  Presented technical research papers of over the world and owns several worldwide patents for soldering applications.

To register please click on the link below:

Nov. 14 @ 11:00am EST - Click here to register

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