Equipment Designed to Increase Semiconductor Yields

ITW EAE plays a major role in semiconductor packaging, including stencil printing solder bumps, dispensing underfills and encapsulant liquids, thermal processing die attach adhesives, cleaning before and after wire bonding, solder ball reflow and more.

Semiconductor Packaging

Advanced packaging and component miniaturization are putting increasingly complex demands on semiconductor manufacturing that pushes the limits of electronic assembly equipment. Developments in flip chip packaging, advanced fan-out packages (FOWLP), System in Package technologies and 3D stacking are being developed to meet next generation market requirements. ITW EAE works with the world’s leading semiconductor manufacturers in developing equipment that addresses evolving technical challenges while also meeting the need for higher throughput, yield and performance.

ITW EAE Semiconductor Equipment - download brochure

Printing:  MPM stencil printers provide the precision and accuracy needed for semiconductor manufacturing. Stencil printing of solder paste, flux, and other materials for advanced semiconductor packaging applications such wafer bumping, CSPs, BGAs, flip chips and SIPs has been proven as an effective, low cost solution. MPM Edison is optimized for ultra-fine pitch printing with a transfer efficiency that exceeds requirements for micro-thin stencil apertures. The Edison is the most accurate printer in the market with proven print process capability greater than 2 Cpk for 0201 metric components. Thin substrate printing is supported with a dedicated vacuum system and an ultra-tight coplanarity between the stencil and the substrate to ensure consistent print quality.

MPM Small Feature Aperture Printing - Technical Paper

Dispensing: Camalot offers high-speed, extremely accurate dispensing of underfill and encapsulation molding, epoxy adhesives, polymers, photoresist, and flux. The Prodigy dispenser addresses the need for increased throughput with the Dynamic Dual Head (DDH). It allows synchronous dispensing with two pumps regardless of part-to-part rotation. A variety of high-speed pumps are available to suit the application. Closed-loop monitoring of the substrate temperature ensures process stability and yield improvements for underfill applications. The platform design is Semi S2/S8 complaint and can also meet Class 1000 cleanroom requirements by request.

Reflow soldering: A forced convection oven is needed for reflow of ball mounts (bumping). Nitrogen atmosphere is used to reduce oxidation of the surfaces and minimize voids in the interfaces. Electrovert reflow soldering ovens are designed to deliver excellent thermal performance combined with process capability and control.  Electrovert sets the standard in innovative technologies that save on the lowest power and nitrogen consumption rates. Electrovert’s closed-loop nitrogen control feature provides an automatic approach to maintaining and controlling PPM levels within the reflow zones.  Closed-loop nitrogen control has the potential to significantly reduce nitrogen consumption, especially in high-mix low-volume production environments.

Cleaning: Electrovert cleaning equipment plays a critical role in semiconductor fabrication and are utilized in multiple steps, including degreasing, cleaning prior to electroplating and underfill, cleaning after bumping and wire bonding, and carrier debonding of fan-out packages.  Cleaning helps to remove flux residue, excess adhesive, grease and oils to ensure proper bonding and material distribution and avoid defects and increase yields. Electrovert cleaners are designed to deal with small, lightweight semiconductor products such as lead frames, BGAs, wafers and 3D stacked packages. The Aquastorm delivers a small spray-jet mist that is less than 40 PSI. It delivers a dynamic combination of chemistry, thermal, and mechanical forms of energy at the surface to effectively clean under low stand-off and difficult to clean components. The MicroCel cleaner uses centrifugal energy for unparalleled penetration, solubilization and containment removal for advanced packages including flip chips, MCMs, SIPs, BGAs, CSPs, and hybrid electronics.

Thermal Processing: Despatch ovens provide clean process, low oxygen, fast cycle curing of adhesives and polymers used in high-volume semiconductor packaging and assembly. Despatch ovens have superior temperature uniformity of ± 0.5% of setpoint and offer SEMI S2/S8, CE, and SECS/GEM communication. Low particulate environmental controls protect from contamination and low oxygen levels prevent oxidation. Despatch ovens are used for adhesive bonding and curing, encapsulant curing, underfill curing of CMOS optical sensors, die attach and BGA, B-stage adhesive curing, polyimide curing, metallic thin film annealing, and photoresist curing.