The MPM Edison™ is ideally suited for the growing Automotive and Smart Device manufacturing markets. The Edison printer is the industries’ most accurate printer with +/- 15μ @ 6σ wet print repeatability. Total throughput is lightning fast due in part to the highly-efficient, parallel processing of the stencil shuttle system, stencil wiping, paste dispensing and vision alignment system.
The Edison printer delivers an impressive 2X throughput compared to competitive printers: 15 seconds total throughput - including stencil wipe cycle.
That’s due in part to a highly-efficient parallel processing stencil shuttle system, wiper, vision gantry - along with other cycle time reductions and innovations - help Edison printers deliver double the throughput of best-in-class printers worldwide.
Best-in-class printing with a 25% improvement in wet print accuracy over current printers: Built-in +/- 8 micron alignment, and +/- 15 micron wet print repeatability (≥2 Cpk @ 6σ) proven through 3rd party Print Capability Analysis (PCA) testing.
Simple, intuitive Intueri operator interface with a flexible, wide array of configuration variables. Combine with OpenApps for maximum capability and connectivity. The Intueri is a portal to Industry 4.0 concepts.
The Edison recessed front design provides unprecedented access to tooling, for easier service without reaching, bending, or fatigue. Edison can also be configured Back-to-Back for a flexible dual lane solution without adding line length.
Single-axis, closed-loop pressure control for dual squeegee eliminates front-to-back variation. A single high-precision load cell provides squeegee force, and a unique algorithm calibrates out non-linearity, maintainng the set pressure across the entire board surface.
Overall gantry thickness is only 39mm. High speed vision uses an on the fly Power Over Ethernet (POE) camera; A single CCD split field provides precision simultaneous up-down image acquisition. Field of Vision (FOV) 9.7 x 6.0 mm.
The MPM's EdgeLoc™+ board clamping system allows a software-controlled change between edge and top clamping.
EdgeLoc+ uses software controls pressure for optimal board holding force, automatically adapting to the programmed board thickness. Hold thin boards with the top clamps while simultaneously adding light edge clamping force for maximum flexibility.
OpenApps is an MPM open architecture source code that allows customers and third parties to develop custom interfaces in support of Industry 4.0 initiatives and Manufacturing Execution Systems (MES).
The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration ‘on the fly’ to stay on target and prevent print defects.
The super-size 65m roll lets you make 10,000 prints between change-outs (for example, assuming 5-print frequency) - for less down time. The system also features a unique Contamination Control Design.