Electronic Assembly Printers

Edison Printer

  • The next generation MPM Edison is designed to meet the demand for increasing throughput, yield, and performance requirements from automotive and smart-device electronics manufacturers.

  • The MPM's Edgeloc+ board clamping system allows operators to switch between edge and top clamping through software controls.

  • The walk-in design of the Edison printer allows easy access to tooling during changeover.  All serviceable controls are also located in the front for easy access.

  • The Edison’s ultra-fast, highly efficient wiping system features a super-size paper roll which reduces downtime and operator interface.  Downtime is further reduced with the automatic paste dispenser.

  • The MPM Edison printer received the prestigious NPI award for electronic assembly equipment - Screen/Stencil Printer Equipment (2016)

  • The MPM Edison printer received the 2015 Global Technology Award for next generation printing technology.

  • The MPM Edison printer received the 10th VA Excellent Award in the Solder Paste Printing-Stencil & Screen Printing category.

Overview

The MPM Edison™ is ideally suited for the growing Automotive and Smart Device manufacturing markets.  The Edison printer is the industries’ most accurate printer with +/- 15μ @ 6σ wet print repeatability. Total throughput is lightning fast due in part to the highly-efficient, parallel processing of the stencil shuttle system, stencil wiping, paste dispensing and vision alignment system.

Benefits and Features

Unparalleled Throughput and Speed

The Edison printer delivers an impressive 2X throughput compared to competitive printers: 15 seconds total throughput - including stencil wipe cycle. 

That’s due in part to a highly-efficient parallel processing stencil shuttle system, wiper, vision gantry - along with other cycle time reductions and innovations - help Edison printers deliver double the throughput of best-in-class printers worldwide.

Incomparable Wet Print Accuracy

Best-in-class printing with a 25% improvement in wet print accuracy over current printers: Built-in +/- 8 micron alignment, and +/- 15 micron wet print repeatability (≥2 Cpk @ 6σ) proven through 3rd party Print Capability Analysis (PCA) testing.

Intueri Graphical User Interface

Simple, intuitive Intueri operator interface with a flexible, wide array of configuration variables. Combine with OpenApps for maximum capability and connectivity. The Intueri is a portal to Industry 4.0 concepts.

Unprecedented Access and Back to Back (BTB) Configurable

The Edison recessed front design provides unprecedented access to tooling, for easier service without reaching, bending, or fatigue. Edison can also be configured Back-to-Back for a flexible dual lane solution without adding line length.

Advanced Print Head

Single-axis, closed-loop pressure control for dual squeegee eliminates front-to-back variation.  A single high-precision load cell provides squeegee force, and a unique algorithm calibrates out non-linearity, maintainng the set pressure across the entire board surface.  

Enhanced Technology

High Speed Vision Alignment with Ultra-slim Camera

Overall gantry thickness is only 39mm. High speed vision uses an on the fly Power Over Ethernet (POE) camera; A single CCD split field provides precision simultaneous up-down image acquisition. Field of Vision (FOV) 9.7 x 6.0 mm.

Innovative EdgeLoc+ Advanced Board Clamping

The MPM's EdgeLoc™+ board clamping system allows a software-controlled change between edge and top clamping. 

EdgeLoc+ uses software controls pressure for optimal board holding force, automatically adapting to the programmed board thickness. Hold thin boards with the top clamps while simultaneously adding light edge clamping force for maximum flexibility.

OpenApps Architecture

OpenApps is an MPM open architecture source code that allows customers and third parties to develop custom interfaces in support of Industry 4.0 initiatives and Manufacturing Execution Systems (MES).

SPI Print Optimizer

The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration ‘on the fly’ to stay on target and prevent print defects.

Ultra-fast, High Efficiency Wiping System

The super-size 65m roll lets you make 10,000 prints between change-outs (for example, assuming 5-print frequency) - for less down time. The system also features a unique Contamination Control Design.