The MPM® Edison is an innovative new platform of next-generation printers sharing software, controls, and advanced technologies on a scalable platform. Featuring outstanding speed, accuracy, and performance surpassing best-in-class SMT printers worldwide, Edison is built to excel in every way, with patented features throughout its design.
Edison delivers an unheard-of higher throughput than competitive printers –15 seconds total throughput, including stencil wipe cycle. That’s due in part to an all new highly-efficient parallel processing stencil shuttle system, wiper, vision gantry, and other cycle time reduction and innovations so that Edison delivers double the throughput of best-in-class printers worldwide.
For accuracy, Edison has no equal. Edison has built-in +/- 8 micron alignment, and +/- 15 micron wet print repeatability (≥2 Cpk @ 6σ) proven through 3rd party Print Capability Analysis (PCA) testing. This represents a 25% improvement in wet print accuracy over current best-in-class printing machines.
Intueri is a simple, intuitive operator interface with a flexible, wide array of configuration variables. It is combined with Open Apps for maximum capability and connectivity. Intueri is a portal to Industry 4.0 concepts.
Edison’s recessed front design provides unprecedented access to tooling and makes servicing easy without reaching, bending, or fatigue. Edison can also be configured ‘Back to Back’ for a flexible dual lane solution without adding line length.
Overall gantry thickness is only 39mm featuring ‘on the fly’ ‘POE’ (Power Over Ethernet) camera; A single CCD split field provides precision simultaneous up-down image acquisition; FOV 9.7 x 6.0 mm.
Single axis closed-loop pressure control for dual squeegee eliminates front-to-back variation; a single high precision load cell provides squeegee force, and a unique algorithm calibrates out non-linearity, maintaining the set pressure across the entire board surface.
The super-size 65m roll lets you make 10,000 prints between change-outs, for example, with a 5 print frequency, for less down time; the system also features a unique Contamination Control Design.
MPM's EdgeLoc™+ board clamping system takes board handling to the next level by havning the capability to change between edge and top clamping simply through software.
EdgeLoc uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.
The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration ‘on the fly’ to stay on target and prevent print defects.
MPM’s Open Apps feature is an open architecture source code which provides customers and third parties the capability of developing custom interfaces in support of Industry 4.0 initiatives and Manufacturing Execution Systems (MES).