The MPM Edison™ stencil printer is ideally suited for the growing Automotive and Smart Device manufacturing markets. The Edison printer is the industries’ most accurate printer with +/- 15μ @ 6σ wet print repeatability. Total throughput is lightning fast due in part to the highly-efficient, parallel processing of the stencil shuttle system, stencil wiping, paste dispensing and vision alignment system.
Edison Stencil Printer
EdgeLoc II holds the board using a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact.
The Edison printer delivers an impressive 2X throughput compared to competitive printers: 15 seconds total throughput - including stencil wipe cycle.
That’s due in part to a highly-efficient parallel processing stencil shuttle system, wiper, vision gantry - along with other cycle time reductions and innovations - help Edison printers deliver double the throughput of best-in-class printers worldwide.
Best-in-class printing with a 25% improvement in wet print accuracy over current printers: Built-in +/- 8 micron alignment, and +/- 15 micron wet print repeatability (≥2 Cpk @ 6σ) proven through 3rd party Print Capability Analysis (PCA) testing.
Ability to have three boards in the machine simultaneously, reduced distance on input conveyor by pre-loading the board during the print process results in reduced transfer times and improved cycle time.
10,000 prints per change. Patented paper tension control provides more effective wiping and a separate wiping and printing zone prevents cross contamination.
MPM Intueri is a simple, intuitive operator interface with a flexible, wide array of configuration variables. It is combined with OpenApps for maximum capability and connectivity and provides a portal to Industry 4.0 concepts.
The Edison recessed front design provides unprecedented access to tooling, for easier service without reaching, bending, or fatigue. Edison can also be configured Back-to-Back for a flexible dual lane solution without adding line length.
Single-axis, closed-loop pressure control for dual squeegee eliminates front-to-back variation. A single high-precision load cell provides squeegee force, and a unique algorithm calibrates out non-linearity, maintainng the set pressure across the entire board surface.
Edison features a high-speed vision alignment system with an ultra-thin camera. The overall gantry thickness is only 39 mm featuring an ‘on the fly’ ‘POE’ (Power Over Ethernet) camera. A single CCD split field provides precision simultaneous up-down image acquisition with a field of view 9.0 x 6.0 mm.
OpenApps is an MPM open architecture source code that allows customers and third parties to develop custom interfaces in support of Industry 4.0 initiatives and Manufacturing Execution Systems (MES).
The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration ‘on the fly’ to stay on target and prevent print defects.