Electronic Assembly Printers

Momentum BTB Stencil Printer

  • The Momentum BTB stencil printer gives users greater flexibility for line configuration. Use the superior print performance of the Momentum BTB stencil printer for dual-lane output overall smaller footprint.

  • The MPM EdgeLoc system  uses a side-snugging technique to hold the board securely in position during printing.  This technique delivers excellent print quality while being adaptable for a wide range of applications.

  • The Paste Height Monitor is designed to prevent defects caused by inadequate valumes of paste on the stencil. The Paste Height Monitor combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. 

  • The MPM RapidClean system is a high speed stencil solvent cleaning system that slashes cycle time and improves stencil cleaning performance, especially for fine-pitch stencils.  RapidClean reduces 3 wipe strokes to 2 and cuts cycle time by 5 – 6 seconds per print cycle (compared the standard wiper).


The MPM® Momentum® BTB™ (Back to Back) configurable stencil printer allows dual-lane processing for higher throughput but without increasing either line length or capital investment. The Momentum BTB stencil printer is the most flexible printer in the Momentum platform.

Benefits and Features

More Throughput in Less Space

The Momentum BTB printer is a space-saving 200 mm shorter than the standard Momentum printer. Configure for dual-lane processing by positioning two BTB printers back-to-back in a manufacturing line.

Dual-lane processing generates the output of two printers in the length of one.

Ultimate Flexibility in the Momentum Platform

Use the MPM printer in-line as a stand-alone or configure back-to-back for dual-lane output.  Print multiple products in a single SMT line, for example, print top and bottom sides, print the same side, or print mother/daughter boards. The Momentum BTB printer comes in two different throughput configurations for optimum flexibility in line balancing.

Match Printer Strategy to Dual Lane Strategy

The Momentum BTB printer allows total front-side accessibility and service, with open access to the electrical system, solvent reservoir, and other key components. Because the BTB prtiner requires no read access or extra buffer space, position each printer to maximize your facility floor space.

Proven Momentum Series Accuracy and Performance

Wet Print accuracy of 20µm@6σ, Cpk ≥ 2, with 6σ capability designed in and independently verified. The MPM Momentum series printers are fast, precise, and highly reliable, with performance unmatched by any other printer in their class.

Benchmark™ User Interface with OpenApps™

The ITW EAE's Benchmark software is powerful and intuitive: easy for the average operator to learn and to use.  Benchmark software facilitates rapid set up, assists with operational tasks, and makes changeover quick and easy.  

OpenApps architecture allows your MPM Printer to talk to your manufacturing execution system (MES) for increased functionality without custom development. ITW EAE (formerly Speedline) is the first SMT company to offer open software architecture.

Enhanced Technology

EnclosedFlow™ Print Head

The EnclosedFlow print head offers significant process and cost advantages over printing with metal squeegee blades, particularly for fine-feature printing. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.

The EnclosedFlow print head delivers superior volume/yield on fine pitch pads.  Print fine pitch features such as 01005s and 0.3 mm pitch CSPs with up to 50% greater volume and 25% lower deviation that squeegee blades.  The EnclosedFlow print head ensures optimal aperture filling for fine pitch devices and crisp uniform printing with less waste. 

Innovative EdgeLoc™ Board Clamping System

The EdgeLoc system uses software-controlled pressure for optimal board holding force. The EdgeLoc system automatically adapts to the programmed board thickness and firmly holds the board without the use of top clamps.

RapidClean™ Stencil Cleaner

The RapidClean stencil cleaner is a high-speed stencil cleaning solution that improves cleaning performance and cuts cycle time. The RapidClean stencil cleaner provides precise wet/dry wipe transition and exceptional cleaning results with its paper over plenum design, venture vacuum, and patented roller solvent bar delivery system.

Paste Height Monitor

The paste height monitor is a robust solution that allows the user to monitor the paste roll size on the front squeegee blade during a print stroke.


The PrinTrack feature adds traceability, data harvesting, and reporting to your printing process.  With PrinTrack, you always have an easy access to a comprehensive history, detailing: 

  • How your product was printed
  • When it was printed 
  • The process parameters used to print the board
  • All pertinent information that can be used to track products or troubleshoot the process if needed.

A flexible web reporting interface can be user-configured to produce traceability reports. 

Advanced Inspection and SPC Tools

The Momentum BTB incorporates expanded 2D inspection capabilities, featuring both the MPM patented contrast and texture-based technologies: BridgeVision and StencilVision™.

Powerful Statistical Process Control (SPC) tools combine with these advanced vision and data acquisition technologies to facilitate maximum process analysis and optimization.

SPI Print Optimizer

The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration on the fly to stay on target and prevent print defects.

OpenApps Architecture

MPM OpenApps features an open architecture source code which equips customers and third parties with the opportunity for developing custom interfaces in support of Industry 4.0 initiatives and Manufacturing Execution Systems (MES).