The MPM® Momentum® BTB is a Back to Back configurable Momentum printer. BTB configurability allows dual lane processing for higher throughput, but without increasing line length or capital investment. It’s the ultimate in flexibility in the proven Momentum platform.
Momentum BTB Printer
The Momentum BTB is a space-saving 200mm shorter than the standard Momentum. Configured for Back-to-Back (BTB) processing, e.g., two individual printers positioned back to back in a manufacturing line, it enables dual lane processing with the combined output of two machines, but in the line length of one.
Use in-line, as a stand-alone, or configure back to back for dual lane output. Print multiple products in a single SMT line, e.g., top and bottom side, same side, or mother/daughter boards. Momentum BTB is offered in two different throughput configurations for optimum flexibility in line balancing.
Momentum BTB is designed for total front-side total accessibility and service – to the electrical system, solvent reservoir, and more. Since no rear access is needed, no space is required between BTB machines, making the most of every inch of floor space.
Wet Print accuracy of 20µm@6σ, Cpk ≥ 2, with 6σ capability designed in and independently verified. MPM Momentum series printers are fast, precise, and highly reliable, with performance unmatched by any other printer in their class.
Easy to learn and use for the average operator, Speedline’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. OpenApps™ Open Software Architecture (Patent Pending) allows your MPM Printer to ‘talk’ to your MES System. You get functionality without custom development - Create your own apps! Speedline is the first SMT company to offer open software architecture.
EnclosedFlow offers significant process and cost advantages over printing with metal squeegee blades, particularly for fine-feature printing. Solder paste is held within an enclosed chamber, and is directly mechanically pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.
EdgeLoc uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps.
RapidClean is MPM’s high-speed stencil cleaning solution that improves cleaning performance and cuts cycle time. RapidClean provides precise wet-dry wipe transition and exceptional cleaning results with its paper over plenum design, venture vacuum, and patented roller solvent bar delivery system.
Momentum incorporates expanded 2D inspection capabilities, featuring both MPM’s patented contrast and texture-based technologies with BridgeVision® and StencilVision™. Powerful SPC program tools combine with these advanced vision and data acquisition technologies to facilitate maximum process analysis and optimization.
MPM’s PrinTrack adds traceability, data harvesting, and reporting to your printing process. With PrinTrack, you always have an easily-accessible, comprehensive history detailing how your product was printed, when it was made, the process parameters used to print it, and all pertinent information that can be used to track products or troubleshoot the process if needed. A flexible Web reporting interface can be user-configured to produce traceability reports. PrinTrack is a portal to the Industry 4.0 evolution; it features open architecture for seamless integration, a standard method of connecting to MES and ERP systems, and its open architecture makes it highly compatible and expandable to factory-wide Track, Trace, and Control systems.
The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration ‘on the fly’ to stay on target and prevent print defects.
MPM’s Open Apps feature is an open architecture source code which provides customers and third parties the capability of developing custom interfaces in support of Industry 4.0 initiatives and Manufacturing Execution Systems (MES).