The MPM® Momentum® BTB™ (Back to Back) configurable stencil printer allows dual-lane processing for higher throughput but without increasing either line length or capital investment. The Momentum BTB stencil printer is the most flexible printer in the Momentum platform.
Momentum BTB Stencil Printer
The Momentum BTB printer is a space-saving 200 mm shorter than the standard Momentum printer. Configure for dual-lane processing by positioning two BTB printers back-to-back in a manufacturing line.
Dual-lane processing generates the output of two printers in the length of one.
Use the MPM printer in-line as a stand-alone or configure back-to-back for dual-lane output. Print multiple products in a single SMT line, for example, print top and bottom sides, print the same side, or print mother/daughter boards. The Momentum BTB printer comes in two different throughput configurations for optimum flexibility in line balancing.
The Momentum BTB printer allows total front-side accessibility and service, with open access to the electrical system, solvent reservoir, and other key components. Because the BTB prtiner requires no read access or extra buffer space, position each printer to maximize your facility floor space.
Wet Print accuracy of 20µm@6σ, Cpk ≥ 2, with 6σ capability designed in and independently verified. The MPM Momentum series printers are fast, precise, and highly reliable, with performance unmatched by any other printer in their class.
The ITW EAE's Benchmark software is powerful and intuitive: easy for the average operator to learn and to use. Benchmark software facilitates rapid set up, assists with operational tasks, and makes changeover quick and easy.
OpenApps architecture allows your MPM Printer to talk to your manufacturing execution system (MES) for increased functionality without custom development. ITW EAE (formerly Speedline) is the first SMT company to offer open software architecture.
The EnclosedFlow print head offers significant process and cost advantages over printing with metal squeegee blades, particularly for fine-feature printing. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.
The EnclosedFlow print head delivers superior volume/yield on fine pitch pads. Print fine pitch features such as 01005s and 0.3 mm pitch CSPs with up to 50% greater volume and 25% lower deviation that squeegee blades. The EnclosedFlow print head ensures optimal aperture filling for fine pitch devices and crisp uniform printing with less waste.
The EdgeLoc system uses software-controlled pressure for optimal board holding force. The EdgeLoc system automatically adapts to the programmed board thickness and firmly holds the board without the use of top clamps.
The RapidClean stencil cleaner is a high-speed stencil cleaning solution that improves cleaning performance and cuts cycle time. The RapidClean stencil cleaner provides precise wet/dry wipe transition and exceptional cleaning results with its paper over plenum design, venture vacuum, and patented roller solvent bar delivery system.
The paste height monitor is a robust solution that allows the user to monitor the paste roll size on the front squeegee blade during a print stroke.
The PrinTrack feature adds traceability, data harvesting, and reporting to your printing process. With PrinTrack, you always have an easy access to a comprehensive history, detailing:
- How your product was printed
- When it was printed
- The process parameters used to print the board
- All pertinent information that can be used to track products or troubleshoot the process if needed.
A flexible web reporting interface can be user-configured to produce traceability reports.
The Momentum BTB incorporates expanded 2D inspection capabilities, featuring both the MPM patented contrast and texture-based technologies: BridgeVision™ and StencilVision™.
Powerful Statistical Process Control (SPC) tools combine with these advanced vision and data acquisition technologies to facilitate maximum process analysis and optimization.
The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration on the fly to stay on target and prevent print defects.
MPM OpenApps features an open architecture source code which equips customers and third parties with the opportunity for developing custom interfaces in support of Industry 4.0 initiatives and Manufacturing Execution Systems (MES).