The MPM® 100 is a hard-working, value-priced printer utilizing the robust, reliable Momentum series platform proven in top facilities around the world. Featuring a modest footprint that can grow with the user: add or retrofit innovative, patented features as throughput demands grow.
MPM 100 Printer
Wet Print accuracy of 20µm@6σ, Cpk ≥ 2, with 6σ capability designed in and independently verified. The MPM Momentum series printers are fast, precise, and highly reliable, with performance unmatched by any other printer in their class.
The MPM 100 is a space-saving 200 mm shorter than the standard Momentum printer platform. Configured for Back-to-Back (BTB) processing, for example, two individual printers back to back in a manufacturing line enables dual-lane processing with the combined output of two machines, but in the line length of one.
The MPM 100 is designed for total front-side accessibility for simplified service to the electrical system, access to the solvent reservoir, and more.
Without the need for rear access space, adjacent BTB machines help you make the most of every inch of your floor space.
Accurate and repeatable performance delivers quality products with fewer defects. The reasonable cost of ownership for the MPM 100 printer ensures you'll see a faster ROI, and higher profitability going forward.
The ITW EAE's Benchmark software is powerful and intuitive: easy for the average operator to learn and to use. Benchmark software facilitates rapid set up, assists with operational tasks, and makes changeover quick and easy.
OpenApps architecture allows your MPM Printer to talk to your manufacturing execution system (MES) for increased functionality without custom development. ITW EAE (formerly Speedline) is the first SMT company to offer open software architecture.
The MPM 100 incorporates expanded 2D inspeciton capabilities, featuring the BridgeVision™ and StencilVision™.
Powerful statistical process control (SPC) program tools combine with these advanced vision and data acquisition technologies to maximize process analysis and optimization.
MPM OpenApps features an open architecture source code which equips customers and third parties with the opportunity for developing custom interfaces in support of Industry 4.0 initiatives and Manufacturing Execution Systems (MES).
Industry-standard sealed cartridges release precise, measured amounts of solder paste, adhesive, flux, encapulants, or ink across the stencil in a clean, uniform bead. Deposition volumes, frequency, and placement are user-programmable.
The paste height monitor is a robust solution that allows the user to monitor the paste roll size on the front squeegee blade during a print stroke.
The PrinTrack feature adds traceability, data harvesting, and reporting to your printing process. With PrinTrack, you always have an easy access to a comprehensive history, detailing:
- How your product was printed
- When it was printed
- The process parameters used to print the board
- All pertinent information that can be used to track products or troubleshoot the process if needed.
A flexible web reporting interface can be user-configured to produce traceability reports. PrinTrack is a portal to the Industry 4.0 evolution; it features open architecture for seamless integration, a standard method of connecting to MES and ERP systems, and its open architecture makes PrinTrack highly compatible and expandable to factory-wide Track, Trace, and Control systems.
The RapidClean stencil cleaner is a high-speed stencil cleaning solution that improves cleaning performance and cuts cycle time. The RapidClean stencil cleaner provides precise wet/dry wipe transition and exceptional cleaning results with its paper over plenum design, venture vacuum, and patented roller solvent bar delivery system.
The UltraWipe stencil cleaner uses a paper-over-plenum design along with a venturi vacuum, and patented roller solvent bar delivery system. This software-controlled feature provides precise wet/dry wipe transition and exceptional cleaning results.
The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration on the fly to stay on target and prevent print defects.