MPM Printers Features

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Edison Printer

Advanced Print Head

 

Edison’s advanced print head features a single high precision load cell with closed-loop pressure control and motor drive system enable precise and consistent squeegee force control across print stroke in both directions, which helps improve yields especially for challenging thin substrate printing in the semiconductor industry.

Board Staging

Board Staging is a new Edison feature that provides the ability to have three boards in the machine simultaneously. It pre-loads the next board on the input conveyor during the print process resulting in reduced transfer times and improved cycle time.

High Speed Vision Alignment with Ultra-slim Camera

 

Overall gantry thickness is only 39 mm.  High speed vision uses an on the fly Power Over Ethernet (POE) camera.  A single CCD split field provides precision simultaneous updown image acquisition. Field of Vision (FOV) 9.7 x 6.0 mm.

EdgeLoc II Advanced Board Clamping

 

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. Choose the robust EdgeLoc II with side only clamping or EdgeLoc+ which can change between edge and top clamping.

OpenApps Architecture

 

MPM® OpenApps™ software features open architecture source code which equips customers and third parties with the opportunity for developing custom interfaces in support of Industry 4.0 initiatives and Manufacturing Execution Systems (MES).

OpenApps creates new communication possibilities for easy two-way communication between the printer and an in-house MES. 

ITW EAE (formerly Speedline) is the first SMT equipment company to offer open software architecture and all the creative possibilities that it brings.

  • OpenApps™ Open Software Architecture allows your MPM Printer can talk to your MES System
  • Functionality without custom development
  • Create your own apps
  • Windows 7 compatible

Intueri Graphical User Interface

 

Simple, intuitive Intueri operator interface with a flexible, wide array of configuration variables. Combine with OpenApps for maximum capability and connectivity. The Intueri is a portal to Industry 4.0 concepts.

SPI Print Optimizer

The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration on the fly to stay on target and prevent print defects.

The MPM-developed communication interface allows the SPI Print Optimizer to see the X, Y, and Theta offsets on printed circuit board (PCB) being printed. The SPI Print Optimizer instantly analyzes the PCB data and provides instructions to the printer to correct those offsets. Automatic and on-the-fly corrections:

  • Increase first pass yields
  • Stabilize the print process by correcting offsets
  • Build consistency
  • Provide a fine-pitch printing advantage
  • Maximize stencil to board alignment
  • Require less operator tweaking since process is automated
  • Reduce set-up time
  • Increase run time

Optimize deposition for better solder joints.

Unparalleled Throughput and Speed

 

The Edison printer delivers an impressive 2X throughputcompared to competitive printers: 15 seconds total throughput - including stencil wipe cycle. 

That’s due in part to an all new highly-efficient parallel processing stencil shuttle system, wiper, vision gantry, and other cycle time reduction and innovations so that Edison delivers double the throughput of best-in-class printers worldwide.

Unprecendented Access and Back to Back (BTB) Configurable

 

The Edison recessed front design provides unprecedented access to tooling for easier service without reaching, bending, or fatigue. Edison can also be configured Back-to-Back for a flexible dual lane solution without adding line length.

Ultra-fast, High Efficiency Wiping System

 

The super-size 65mm roll lets you make 10,000 prints between change-outs, (for example, with a five-print frequency) - for less downtime. The system also features a uniqur Contamination Control Design.

Momentum BTB Printer

Advanced Inspection and SPC Tools

 

The Momentum series incorporates expanded 2D inspection capabilities, featuring both the MPM patented contrast and texture-based technologies: BridgeVision™ and StencilVision™.

Powerful Statistical Process Control (SPC) tools combine with these advanced vision and data acquisition technologies to facilitate maximum process analysis and optimization.

SPC tools measure the amount of paste covering the target pad and compares it with the required coverage. This has proven to be an effective way to eliminate print defects and increase overall yields faster, with accuracy as reliable as SPI systems but at a fraction of the cost.

Advanced inspection and SPC tools:

  • MPM Patented system
  • State-of-the-art camera
  • Advanced optics and lighting
  • Configurable to the device level
  • Ensure precise board-to-stencil alignment
  • Superb alignment and post-print inspection
  • 2D Inspection integrated directly into the printer

Intuitive Benchmark User Interface

MPM® Benchmark™ software is powerful and intuitive: easy for the average operator to learn and to use. Benchmark software facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy.

BridgeVision System

 

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

  • Finds bridging defects post-print – before they go to reflow
  • Patented contrast and texture-based technologies
  • Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

EdgeLoc II Board Clamping System

The Edgeloc system securely holds the board during printing using a side snugging technique. Flippers engage to secure the board across the top edge, which ensures board flatness, and removes any warpage from the board. This technique delivers the best print quality and is the most adaptable system for the widest range of applications.

EnclosedFlow Print Head

The EnclosedFlow™ print head offers significant process and cost advantages over printing with metal squeegee blades, particularly for fine-feature printing. Solder paste is held within an enclosed chamber and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.

The EnclosedFlow print head delivers superior volume/yield on fine pitch pads. Print fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than squeegee blades. The EnclosedFlow print head ensures optimal aperture filling for fine pitch devices and crisp uniform printing with less waste.

EnclosedFlow delivers:

  • Tremendous savings on print media
  • Optimum aperture fill for fine pitch
  • Improved volume deposition
  • Tight process control of print process
  • Cleaning is fast and simple due to fewer parts
  • Fast changeover for high mix manufacturing
  • ‘smart’ compensation for PCB variables

GerberEZ Teach System

 

The GerberEZ Teach™ system makes the industry’s most advanced inspection system even more powerful and user-friendly.

The GerberEZ Teach system makes 2D inspection programming point-and-click easy, with an intuitive tool bar and features like fast component identification, custom device, off angle, and device specific capabilities.

Locate specific on-board devices based on device type and complexity:

  • Import GerberEZ Teach data into Benchmark software for 2D inspection
  • Fast component identification
  • Simple custom device teach
  • Special workflow task list
  • Device specific inspection criteria
  • Off-angle capability

Able to save multiple output files in one workspace—ideal for top and bottom side.

OpenApps Architecture

 

MPM® OpenApps™ software features open architecture source code which equips customers and third parties with the opportunity for developing custom interfaces in support of Industry 4.0 initiatives and Manufacturing Execution Systems (MES).

OpenApps creates new communication possibilities for easy two-way communication between the printer and an in-house MES. 

ITW EAE (formerly Speedline) is the first SMT equipment company to offer open software architecture and all the creative possibilities that it brings.

  • OpenApps™ Open Software Architecture allows your MPM Printer can talk to your MES System
  • Functionality without custom development
  • Create your own apps
  • Windows 7 compatible

Paste Height Monitor

The Paste Height Monitor is a robust solution that allows users to monitor the paste roll size on the front squeegee blade during a print stroke.

The Paste Height Monitor combines advanced software and sensor technology to effectively and accurately monitor the paste bead for volume consistency. The sensor is mounted on the back of the squeegee head and measures solder paste bead diameter during the front-to-rear stroke.

  • Avoid defects caused by inadequate paste deposition
  • Monitors paste roll diameter during the front-to-rear stroke
  • Automatically Dispenses Paste/Notifies Operator to Add Paste
  • Prevents defects caused by operators adding excessive paste
  • Recovery Wizard alerts operator to add paste manually
  • Recovery Wizard guides operator through the process
  • No mechanical contact with the stencil
  • Promotes greater print consistency

PrinTrack

 

The PrinTrack™ feature adds traceability, data harvesting and reporting capabilities to your printing process. With PrinTrack, you always have easy access to a comprehensive history, detailing:

  • How your board was printed
  • When the board was printed
  • The process parameters used to print the board
  • All information pertinent for tracking products or troubleshooting the process, if needed.

A flexible web reporting interface can be user-configured to produce traceability reports.

RapidClean Stencil Cleaner

The RapidClean™ stencil cleaner is a high-speed solution that improves cleaning performance and cuts cycle time. The RapidClean stencil cleaner provides precise wet/dry wipe transition and exceptional cleaning results using a paper-over-plenum design, venturi  vacuum, and patented roller solvent bar delivery system.

The RapidClean stencil cleaner promotes less cleaning because the process is more efficient, reducing both the number of cleaning cycles and reducing cycle time for higher productivity.

  • Greatly enhances fine-feature printing
  • Combines a vacuum and solvent stroke into a single wiper stroke
  • Cuts stencil cleaning cycle times by 5–6 seconds over the standard wiper
  • Improves cleaning effectiveness
  • Reduces paper costs
  • Improves throughput
  • Increases uptime

SPI Print Optimizer

The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration on the fly to stay on target and prevent print defects.

The MPM-developed communication interface allows the SPI Print Optimizer to see the X, Y, and Theta offsets on printed circuit board (PCB) being printed. The SPI Print Optimizer instantly analyzes the PCB data and provides instructions to the printer to correct those offsets. Automatic and on-the-fly corrections:

  • Increase first pass yields
  • Stabilize the print process by correcting offsets
  • Build consistency
  • Provide a fine-pitch printing advantage
  • Maximize stencil to board alignment
  • Require less operator tweaking since process is automated
  • Reduce set-up time
  • Increase run time

Optimize deposition for better solder joints.

StencilVision System

 

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

  • Detects solder paste seepage from apertures to stencil underside
  • Initiates underside stencil wiping sequence to remove contamination
  • Prevents print defects, contamination of PCB caused by dirty stencil underside
  • Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing

Momentum II Elite Printer

Advanced Inspection and SPC Tools

 

The Momentum series incorporates expanded 2D inspection capabilities, featuring both the MPM patented contrast and texture-based technologies: BridgeVision™ and StencilVision™.

Powerful Statistical Process Control (SPC) tools combine with these advanced vision and data acquisition technologies to facilitate maximum process analysis and optimization.

SPC tools measure the amount of paste covering the target pad and compares it with the required coverage. This has proven to be an effective way to eliminate print defects and increase overall yields faster, with accuracy as reliable as SPI systems but at a fraction of the cost.

Advanced inspection and SPC tools:

  • MPM Patented system
  • State-of-the-art camera
  • Advanced optics and lighting
  • Configurable to the device level
  • Ensure precise board-to-stencil alignment
  • Superb alignment and post-print inspection
  • 2D Inspection integrated directly into the printer

Automatic Pin Placement

Automatic Pin Placement is a patented MPM tooling solution that uses the vision gantry to precisely place and remove pins. Pin patterns are software programmable and ensure quick, easy, and repeatable product changeover.

BridgeVision System

 

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

  • Finds bridging defects post-print – before they go to reflow
  • Patented contrast and texture-based technologies
  • Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

Camalot Inside Integrated Dispensing System

Whether adding solder paste for components or epoxy for connectors, the Camalot Inside system ensures optimum dispense speeds while improving production line flexibility and productivity.

EnclosedFlow Print Head

The EnclosedFlow™ print head offers significant process and cost advantages over printing with metal squeegee blades, particularly for fine-feature printing. Solder paste is held within an enclosed chamber and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.

The EnclosedFlow print head delivers superior volume/yield on fine pitch pads. Print fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than squeegee blades. The EnclosedFlow print head ensures optimal aperture filling for fine pitch devices and crisp uniform printing with less waste.

EnclosedFlow delivers:

  • Tremendous savings on print media
  • Optimum aperture fill for fine pitch
  • Improved volume deposition
  • Tight process control of print process
  • Cleaning is fast and simple due to fewer parts
  • Fast changeover for high mix manufacturing
  • ‘smart’ compensation for PCB variables

GerberEZ Teach System

 

The GerberEZ Teach™ system makes the industry’s most advanced inspection system even more powerful and user-friendly.

The GerberEZ Teach system makes 2D inspection programming point-and-click easy, with an intuitive tool bar and features like fast component identification, custom device, off angle, and device specific capabilities.

Locate specific on-board devices based on device type and complexity:

  • Import GerberEZ Teach data into Benchmark software for 2D inspection
  • Fast component identification
  • Simple custom device teach
  • Special workflow task list
  • Device specific inspection criteria
  • Off-angle capability

Able to save multiple output files in one workspace—ideal for top and bottom side.

Increased Yields with RapidView Inspection

 

Built on our patented optics technology, the RapidView™ system delivers high-speed 2D inspection with device-level SPC reporting. RapidView™ inspection is up to three and half times faster than our standard system, can increase the Field of View (FOE) by 4x, and can work in conjunction with our GerberEZ Teach™ system.

EdgeLoc II Board Clamping System

The Edgeloc system securely holds the board during printing using a side snugging technique. Flippers engage to secure the board across the top edge, which ensures board flatness, and removes any warpage from the board. This technique delivers the best print quality and is the most adaptable system for the widest range of applications.

Intuitive Benchmark User Interface

MPM® Benchmark™ software is powerful and intuitive: easy for the average operator to learn and to use. Benchmark software facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy.

OpenApps Architecture

 

MPM® OpenApps™ software features open architecture source code which equips customers and third parties with the opportunity for developing custom interfaces in support of Industry 4.0 initiatives and Manufacturing Execution Systems (MES).

OpenApps creates new communication possibilities for easy two-way communication between the printer and an in-house MES. 

ITW EAE (formerly Speedline) is the first SMT equipment company to offer open software architecture and all the creative possibilities that it brings.

  • OpenApps™ Open Software Architecture allows your MPM Printer can talk to your MES System
  • Functionality without custom development
  • Create your own apps
  • Windows 7 compatible

Paste Temperature Monitor

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

Paste Height Monitor

The Paste Height Monitor is a robust solution that allows users to monitor the paste roll size on the front squeegee blade during a print stroke.

The Paste Height Monitor combines advanced software and sensor technology to effectively and accurately monitor the paste bead for volume consistency. The sensor is mounted on the back of the squeegee head and measures solder paste bead diameter during the front-to-rear stroke.

  • Avoid defects caused by inadequate paste deposition
  • Monitors paste roll diameter during the front-to-rear stroke
  • Automatically Dispenses Paste/Notifies Operator to Add Paste
  • Prevents defects caused by operators adding excessive paste
  • Recovery Wizard alerts operator to add paste manually
  • Recovery Wizard guides operator through the process
  • No mechanical contact with the stencil
  • Promotes greater print consistency

PrinTrack

 

The PrinTrack™ feature adds traceability, data harvesting and reporting capabilities to your printing process. With PrinTrack, you always have easy access to a comprehensive history, detailing:

  • How your board was printed
  • When the board was printed
  • The process parameters used to print the board
  • All information pertinent for tracking products or troubleshooting the process, if needed.

A flexible web reporting interface can be user-configured to produce traceability reports.

Quick Release Squeegee

New quick release squeegee blades make changing blades quick and easy with no tools required.  It takes less than 30 seconds to change the blade. Momentum II offers an advanced print head featuring a high precision load cell with closed loop pressure control for precise and consistent squeegee force.

RapidClean Stencil Cleaner

The RapidClean™ stencil cleaner is a high-speed solution that improves cleaning performance and cuts cycle time. The RapidClean stencil cleaner provides precise wet/dry wipe transition and exceptional cleaning results using a paper-over-plenum design, venturi  vacuum, and patented roller solvent bar delivery system.

The RapidClean stencil cleaner promotes less cleaning because the process is more efficient, reducing both the number of cleaning cycles and reducing cycle time for higher productivity.

  • Greatly enhances fine-feature printing
  • Combines a vacuum and solvent stroke into a single wiper stroke
  • Cuts stencil cleaning cycle times by 5–6 seconds over the standard wiper
  • Improves cleaning effectiveness
  • Reduces paper costs
  • Improves throughput
  • Increases uptime

SPI Print Optimizer

The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration on the fly to stay on target and prevent print defects.

The MPM-developed communication interface allows the SPI Print Optimizer to see the X, Y, and Theta offsets on printed circuit board (PCB) being printed. The SPI Print Optimizer instantly analyzes the PCB data and provides instructions to the printer to correct those offsets. Automatic and on-the-fly corrections:

  • Increase first pass yields
  • Stabilize the print process by correcting offsets
  • Build consistency
  • Provide a fine-pitch printing advantage
  • Maximize stencil to board alignment
  • Require less operator tweaking since process is automated
  • Reduce set-up time
  • Increase run time

Optimize deposition for better solder joints.

StencilVision System

 

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

  • Detects solder paste seepage from apertures to stencil underside
  • Initiates underside stencil wiping sequence to remove contamination
  • Prevents print defects, contamination of PCB caused by dirty stencil underside
  • Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing

Momentum II HiE Printer

Advanced Inspection and SPC Tools

 

The Momentum series incorporates expanded 2D inspection capabilities, featuring both the MPM patented contrast and texture-based technologies: BridgeVision™ and StencilVision™.

Powerful Statistical Process Control (SPC) tools combine with these advanced vision and data acquisition technologies to facilitate maximum process analysis and optimization.

SPC tools measure the amount of paste covering the target pad and compares it with the required coverage. This has proven to be an effective way to eliminate print defects and increase overall yields faster, with accuracy as reliable as SPI systems but at a fraction of the cost.

Advanced inspection and SPC tools:

  • MPM Patented system
  • State-of-the-art camera
  • Advanced optics and lighting
  • Configurable to the device level
  • Ensure precise board-to-stencil alignment
  • Superb alignment and post-print inspection
  • 2D Inspection integrated directly into the printer

Automatic Pin Placement

Automatic Pin Placement is a patented MPM tooling solution that uses the vision gantry to precisely place and remove pins. Pin patterns are software programmable and ensure quick, easy, and repeatable product changeover.

Intuitive Benchmark User Interface

MPM® Benchmark™ software is powerful and intuitive: easy for the average operator to learn and to use. Benchmark software facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy.

BridgeVision System

 

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

  • Finds bridging defects post-print – before they go to reflow
  • Patented contrast and texture-based technologies
  • Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

Camalot Inside Integrated Dispensing System

Whether adding solder paste for components or epoxy for connectors, the Camalot Inside system ensures optimum dispense speeds while improving production line flexibility and productivity.

EdgeLoc II Board Clamping System

The Edgeloc system securely holds the board during printing using a side snugging technique. Flippers engage to secure the board across the top edge, which ensures board flatness, and removes any warpage from the board. This technique delivers the best print quality and is the most adaptable system for the widest range of applications.

EnclosedFlow Print Head

The EnclosedFlow™ print head offers significant process and cost advantages over printing with metal squeegee blades, particularly for fine-feature printing. Solder paste is held within an enclosed chamber and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.

The EnclosedFlow print head delivers superior volume/yield on fine pitch pads. Print fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than squeegee blades. The EnclosedFlow print head ensures optimal aperture filling for fine pitch devices and crisp uniform printing with less waste.

EnclosedFlow delivers:

  • Tremendous savings on print media
  • Optimum aperture fill for fine pitch
  • Improved volume deposition
  • Tight process control of print process
  • Cleaning is fast and simple due to fewer parts
  • Fast changeover for high mix manufacturing
  • ‘smart’ compensation for PCB variables

GerberEZ Teach System

 

The GerberEZ Teach™ system makes the industry’s most advanced inspection system even more powerful and user-friendly.

The GerberEZ Teach system makes 2D inspection programming point-and-click easy, with an intuitive tool bar and features like fast component identification, custom device, off angle, and device specific capabilities.

Locate specific on-board devices based on device type and complexity:

  • Import GerberEZ Teach data into Benchmark software for 2D inspection
  • Fast component identification
  • Simple custom device teach
  • Special workflow task list
  • Device specific inspection criteria
  • Off-angle capability

Able to save multiple output files in one workspace—ideal for top and bottom side.

OpenApps Architecture

 

MPM® OpenApps™ software features open architecture source code which equips customers and third parties with the opportunity for developing custom interfaces in support of Industry 4.0 initiatives and Manufacturing Execution Systems (MES).

OpenApps creates new communication possibilities for easy two-way communication between the printer and an in-house MES. 

ITW EAE (formerly Speedline) is the first SMT equipment company to offer open software architecture and all the creative possibilities that it brings.

  • OpenApps™ Open Software Architecture allows your MPM Printer can talk to your MES System
  • Functionality without custom development
  • Create your own apps
  • Windows 7 compatible

Paste Height Monitor

The Paste Height Monitor is a robust solution that allows users to monitor the paste roll size on the front squeegee blade during a print stroke.

The Paste Height Monitor combines advanced software and sensor technology to effectively and accurately monitor the paste bead for volume consistency. The sensor is mounted on the back of the squeegee head and measures solder paste bead diameter during the front-to-rear stroke.

  • Avoid defects caused by inadequate paste deposition
  • Monitors paste roll diameter during the front-to-rear stroke
  • Automatically Dispenses Paste/Notifies Operator to Add Paste
  • Prevents defects caused by operators adding excessive paste
  • Recovery Wizard alerts operator to add paste manually
  • Recovery Wizard guides operator through the process
  • No mechanical contact with the stencil
  • Promotes greater print consistency

Paste Temperature Monitor

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

RapidClean Stencil Cleaner

The RapidClean™ stencil cleaner is a high-speed solution that improves cleaning performance and cuts cycle time. The RapidClean stencil cleaner provides precise wet/dry wipe transition and exceptional cleaning results using a paper-over-plenum design, venturi  vacuum, and patented roller solvent bar delivery system.

The RapidClean stencil cleaner promotes less cleaning because the process is more efficient, reducing both the number of cleaning cycles and reducing cycle time for higher productivity.

  • Greatly enhances fine-feature printing
  • Combines a vacuum and solvent stroke into a single wiper stroke
  • Cuts stencil cleaning cycle times by 5–6 seconds over the standard wiper
  • Improves cleaning effectiveness
  • Reduces paper costs
  • Improves throughput
  • Increases uptime

PrinTrack

 

The PrinTrack™ feature adds traceability, data harvesting and reporting capabilities to your printing process. With PrinTrack, you always have easy access to a comprehensive history, detailing:

  • How your board was printed
  • When the board was printed
  • The process parameters used to print the board
  • All information pertinent for tracking products or troubleshooting the process, if needed.

A flexible web reporting interface can be user-configured to produce traceability reports.

Quick Release Squeegee

New quick release squeegee blades make changing blades quick and easy with no tools required.  It takes less than 30 seconds to change the blade. Momentum II offers an advanced print head featuring a high precision load cell with closed loop pressure control for precise and consistent squeegee force.

Increased Yields with RapidView Inspection

 

Built on our patented optics technology, the RapidView™ system delivers high-speed 2D inspection with device-level SPC reporting. RapidView™ inspection is up to three and half times faster than our standard system, can increase the Field of View (FOE) by 4x, and can work in conjunction with our GerberEZ Teach™ system.

SPI Print Optimizer

The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration on the fly to stay on target and prevent print defects.

The MPM-developed communication interface allows the SPI Print Optimizer to see the X, Y, and Theta offsets on printed circuit board (PCB) being printed. The SPI Print Optimizer instantly analyzes the PCB data and provides instructions to the printer to correct those offsets. Automatic and on-the-fly corrections:

  • Increase first pass yields
  • Stabilize the print process by correcting offsets
  • Build consistency
  • Provide a fine-pitch printing advantage
  • Maximize stencil to board alignment
  • Require less operator tweaking since process is automated
  • Reduce set-up time
  • Increase run time

Optimize deposition for better solder joints.

StencilVision System

 

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

  • Detects solder paste seepage from apertures to stencil underside
  • Initiates underside stencil wiping sequence to remove contamination
  • Prevents print defects, contamination of PCB caused by dirty stencil underside
  • Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing

MPM 100 Printer

Advanced Inspection and SPC Tools

 

The Momentum series incorporates expanded 2D inspection capabilities, featuring both the MPM patented contrast and texture-based technologies: BridgeVision™ and StencilVision™.

Powerful Statistical Process Control (SPC) tools combine with these advanced vision and data acquisition technologies to facilitate maximum process analysis and optimization.

SPC tools measure the amount of paste covering the target pad and compares it with the required coverage. This has proven to be an effective way to eliminate print defects and increase overall yields faster, with accuracy as reliable as SPI systems but at a fraction of the cost.

Advanced inspection and SPC tools:

  • MPM Patented system
  • State-of-the-art camera
  • Advanced optics and lighting
  • Configurable to the device level
  • Ensure precise board-to-stencil alignment
  • Superb alignment and post-print inspection
  • 2D Inspection integrated directly into the printer

Intuitive Benchmark User Interface

MPM® Benchmark™ software is powerful and intuitive: easy for the average operator to learn and to use. Benchmark software facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy.

BridgeVision System

 

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

  • Finds bridging defects post-print – before they go to reflow
  • Patented contrast and texture-based technologies
  • Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

GerberEZ Teach System

 

The GerberEZ Teach™ system makes the industry’s most advanced inspection system even more powerful and user-friendly.

The GerberEZ Teach system makes 2D inspection programming point-and-click easy, with an intuitive tool bar and features like fast component identification, custom device, off angle, and device specific capabilities.

Locate specific on-board devices based on device type and complexity:

  • Import GerberEZ Teach data into Benchmark software for 2D inspection
  • Fast component identification
  • Simple custom device teach
  • Special workflow task list
  • Device specific inspection criteria
  • Off-angle capability

Able to save multiple output files in one workspace—ideal for top and bottom side.

OpenApps Architecture

 

MPM® OpenApps™ software features open architecture source code which equips customers and third parties with the opportunity for developing custom interfaces in support of Industry 4.0 initiatives and Manufacturing Execution Systems (MES).

OpenApps creates new communication possibilities for easy two-way communication between the printer and an in-house MES. 

ITW EAE (formerly Speedline) is the first SMT equipment company to offer open software architecture and all the creative possibilities that it brings.

  • OpenApps™ Open Software Architecture allows your MPM Printer can talk to your MES System
  • Functionality without custom development
  • Create your own apps
  • Windows 7 compatible

Paste Height Monitor

The Paste Height Monitor is a robust solution that allows users to monitor the paste roll size on the front squeegee blade during a print stroke.

The Paste Height Monitor combines advanced software and sensor technology to effectively and accurately monitor the paste bead for volume consistency. The sensor is mounted on the back of the squeegee head and measures solder paste bead diameter during the front-to-rear stroke.

  • Avoid defects caused by inadequate paste deposition
  • Monitors paste roll diameter during the front-to-rear stroke
  • Automatically Dispenses Paste/Notifies Operator to Add Paste
  • Prevents defects caused by operators adding excessive paste
  • Recovery Wizard alerts operator to add paste manually
  • Recovery Wizard guides operator through the process
  • No mechanical contact with the stencil
  • Promotes greater print consistency

PrinTrack

 

The PrinTrack™ feature adds traceability, data harvesting and reporting capabilities to your printing process. With PrinTrack, you always have easy access to a comprehensive history, detailing:

  • How your board was printed
  • When the board was printed
  • The process parameters used to print the board
  • All information pertinent for tracking products or troubleshooting the process, if needed.

A flexible web reporting interface can be user-configured to produce traceability reports.

RapidClean Stencil Cleaner

The RapidClean™ stencil cleaner is a high-speed solution that improves cleaning performance and cuts cycle time. The RapidClean stencil cleaner provides precise wet/dry wipe transition and exceptional cleaning results using a paper-over-plenum design, venturi  vacuum, and patented roller solvent bar delivery system.

The RapidClean stencil cleaner promotes less cleaning because the process is more efficient, reducing both the number of cleaning cycles and reducing cycle time for higher productivity.

  • Greatly enhances fine-feature printing
  • Combines a vacuum and solvent stroke into a single wiper stroke
  • Cuts stencil cleaning cycle times by 5–6 seconds over the standard wiper
  • Improves cleaning effectiveness
  • Reduces paper costs
  • Improves throughput
  • Increases uptime

StencilVision System

 

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

  • Detects solder paste seepage from apertures to stencil underside
  • Initiates underside stencil wiping sequence to remove contamination
  • Prevents print defects, contamination of PCB caused by dirty stencil underside
  • Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing

SPI Print Optimizer

The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration on the fly to stay on target and prevent print defects.

The MPM-developed communication interface allows the SPI Print Optimizer to see the X, Y, and Theta offsets on printed circuit board (PCB) being printed. The SPI Print Optimizer instantly analyzes the PCB data and provides instructions to the printer to correct those offsets. Automatic and on-the-fly corrections:

  • Increase first pass yields
  • Stabilize the print process by correcting offsets
  • Build consistency
  • Provide a fine-pitch printing advantage
  • Maximize stencil to board alignment
  • Require less operator tweaking since process is automated
  • Reduce set-up time
  • Increase run time

Optimize deposition for better solder joints.