MPM Printers Features

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Edison Printer

New Intueri Graphical User Interface

 

Intueri is a simple, intuitive operator interface with a flexible, wide array of configuration variables. It is combined with Open Apps for maximum capability and connectivity. Intueri is a portal to Industry 4.0 concepts.

Innovative EdgeLoc™ Tooling

EdgeLoc uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps.

PrinTrack

 

Traceability in electronics manufacturing is more critical today than ever before.  Comprehensive product traceability is the key to maintaining product quality, consistency, and control over your manufacturing process.  It's also a requirement of many hi-reliability end users including Automotive, Smart Device, Industrial, DoD, Medical and hardened electronic OEMs.

MPM offers comprehensive product traceability powered by globally recognized Cogiscan.  MPM's PrinTrack focuses primarily on printing process parameters, solder paste and tooling , but can seamlessly integrate with other equipment and elements in the manufacturing cycle, e.g., MES, ERP, and can be expanded factory-wide.  PrinTrack enables you to track your printed products throughout the SMT assembly line through a simple user interface and flexible reporting.  With PrinTrack, you will always have a complete history detailing how your product was made, when it was made, the process parameters used to print it, and all pertinent information that can be used to track products or troubleshoot the process if needed.

SPI Print Optimizer

MPM’s SPI Print Optimizer is a process optimization tool that brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. Simply put, when the SPI machine ‘sees’ X, Y, and Theta offset problems on PCBs being printed, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

  • Increases first pass yields
  • Stabilizes the print process by correcting offsets; builds consistency
  • Fine pitch printing advantage, maximum stencil to board alignment
  • Less operator ‘tweaking’ since process is automated
  • Reduces set-up time; increases run time
  • Optimized deposition, for better solder joints

Unparalleled Throughput and Speed

 

Edison delivers an unheard-of higher throughput than competitive printers –15 seconds total throughput, including stencil wipe cycle.  That’s due in part to an all new highly-efficient parallel processing stencil shuttle system, wiper, vision gantry, and other cycle time reduction and innovations so that Edison delivers double the throughput of best-in-class printers worldwide.

Unprecendented Access and Back to Back (BTB) Configurable

 

Edison’s recessed front design provides unprecedented access to tooling and makes servicing easy without reaching, bending, or fatigue. Edison can also be configured ‘Back to Back’ for a flexible dual lane solution without adding line length.

High Speed Vision Alignment with Ultra-slim Camera

 

Overall gantry thickness is only 39mm featuring 'on the fly' 'POE" (Power Over Ethernet) camera.  A single CCD split field provides precision simultaneous updown image acquisition; FOV 9.7 x 6.0 mm.

Advanced Print Head Option

 

Single axis closed-loop pressure control for dual squeegee eliminates front-to-back variation; a single high precision load cell provides squeegee force, and a unique algorithm calibrates out non-linearity, maintaining the set pressure across the entire board surface.

Ultra-fast, High Efficiency Wiping System

 

Super-size 65mm roll lets you make 10,000 prints between change-outs, for example, with a 5 print frequency, for less down times; the system also features a uniqur Contamination Control Design.

Open Apps

 

MPM's Open Apps feature is an open architecture source code which provides customers and third parties the capability of developing custom interfaces  in support of Industry 4.0 initiatives and Manufacturing Systems (MES).

The Open Apps Interface (OAI) provides over 100 printer input/ouput variables that can be incorporated into custom applications.  Customers and third parties can then write customer interfaces using our development package which is free of charge.

Momentum BTB Printer

Advanced Inspection and SPC Tools

MPM’s patented printer-based Vision and Advanced Inspection System is a cost-effective way to verify print and paste deposit results. It’s flexible enough to handle the complete range of today’s most challenging components. It measures the amount of paste covering the target pad and compares it with the required coverage. It’s an effective way to eliminate print defects and increase overall yields faster, with accuracy as reliable as SPI systems but at a fraction of the cost.

  • Patented system
  • State-of-the-art camera
  • Advanced optics and lighting
  • Configurable down to device level
  • Ensures precise board-to-stencil alignment
  • Superb alignment and post-print inspection
  • 2D Inspection integrated directly into the printer

Benchmark

Benchmark 4.0 software, for the Printer platforms, operates with the Windows 7 OS system and incorporates the familiar Benchmark GUI and functionality, with added improvements in feature function that come from using Windows 7. 4.0 also incorporates a unique, empowering new Open Software Architecture, OpenApps (Patent Pending). OpenApps creates new communication possibilities for easy two-way communication between the printer and an in-house MES. Speedline is the first SMT equipment company to offer open software architecture and all of the creative possibilities that it brings.

  • OpenApps™ Open Software Architecture
  • Your MPM Printer can ‘talk’ to your MES System
  • Functionality without custom development
  • Create your own apps
  • Windows 7 compatible

BridgeVision

 

The BridgeVision system is a patented method of analyzing bridge defects on circuit boards in the post-print inspection process. This innovative system utilizes texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

  • Finds bridging defects post-print – before they go to reflow
  • Patented contrast and texture-based technologies
  • Combines with SPC tools
  • Operates simultaneously with MPM’s 2D paste inspection

EdgeLoc

The EdgeLoc system securely holds the PCB in place during printing using a side snugging technique. Flippers engage to secure the board across the top edge, which ensures board flatness, and removes any warpage from the board. The Z tower raises the board to the programmed height based on board thickness, software-controlled snuggers clamp the board edge across entire length of the PCB, and then the flippers retract so that there is no interference with full board-to-stencil contact. This technique for securing a board delivers the best print quality and is the most adaptable system for the widest range of applications. 

  • Software-controlled snugger pressure
  • PCB thickness adjusted automatically
  • No manual setup
  • Holds board firmly - no top clamps
  • Optimal stencil to board gasketing
  • Highest paste transfer efficiency
  • Critical for thin PCB applications
  • Provides optimal stencil to board gasketing across the entire board
  • It eliminates paste volume inconsistency for components near the board edge
  • Reduces bleed-out and bridging.

EnclosedFlow

The MPM® EnclosedFlow™ Print Head is an enclosed print media technology that’s different from printing with squeegee blades. Solder paste is held within an enclosed chamber and pressurized during the print stroke to provide uniform aperture filling and superb printing performance especially for fine pitch devices, with less media waste. EnclosedFlow delivers superior volume/yield on fine pitch pads with up to 50% greater volume and 25% lower deviation than squeegee blades.

  • Tremendous savings on print media
  • Optimum aperture fill for fine pitch
  • Improved volume deposition
  • Tight process control of print process
  • Cleaning is fast and simple due to fewer parts
  • Fast changeover for high mix manufacturing
  • ‘smart’ compensation for PCB variables

GerberEZ Teach

 

GerberEZ Teach makes the industry’s most advanced inspection system more powerful and user-friendly. With its user-friendly tool bar and features like fast component identification, custom device, off angle, and device specific capabilities, GerberEZ Teach makes 2D inspection programming a point and click routine. Choose which devices to look for based on device type and complexity.

  • Import Gerber data into benchmark for 2D inspection
  • Fast component identification
  • Simple custom device teach
  • Speedline-specific toolbar
  • Special workflow task list
  • Device specific inspection criteria
  • Off-angle capability
  • Ability to save multiple output files in one workspace – ideal for top and bottom side.

Innovative EdgeLoc™ Tooling

EdgeLoc uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps.

Paste Height Monitor

The Paste Height Monitor is an effective, completely non-contact solution designed to prevent defects caused by inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to effectively and very accurately monitor the paste bead for volume consistency. The sensor is mounted on the back of the squeegee head and measures solder paste bead diameter during the front-to-rear stroke.

  • Avoid defects caused by inadequate paste deposition
  • Monitors paste roll diameter during the front-to-rear stroke
  • Automatically Dispenses Paste/Notifies Operator to Add Paste
  • Prevents defects caused by operators adding excessive paste
  • Recovery Wizard alerts operator to add paste manually
  • Recovery Wizard guides operator through the process
  • No mechanical contact with the stencil
  • Promotes greater print consistency

PrinTrack

 

Traceability in electronics manufacturing is more critical today than ever before.  Comprehensive product traceability is the key to maintaining product quality, consistency, and control over your manufacturing process.  It's also a requirement of many hi-reliability end users including Automotive, Smart Device, Industrial, DoD, Medical and hardened electronic OEMs.

MPM offers comprehensive product traceability powered by globally recognized Cogiscan.  MPM's PrinTrack focuses primarily on printing process parameters, solder paste and tooling , but can seamlessly integrate with other equipment and elements in the manufacturing cycle, e.g., MES, ERP, and can be expanded factory-wide.  PrinTrack enables you to track your printed products throughout the SMT assembly line through a simple user interface and flexible reporting.  With PrinTrack, you will always have a complete history detailing how your product was made, when it was made, the process parameters used to print it, and all pertinent information that can be used to track products or troubleshoot the process if needed.

RapidClean

RapidClean is a high speed stencil cleaning solution that improves stencil cleaning performance and reduces cycle time when using solvent. It’s a faster, more effective way of cleaning fine-pitch stencil apertures for better printing of fine pitch patterns and thus higher yields and fewer defects. It promotes less cleaning because the process is more efficient, reducing the number of cleaning cycles and cycle time for higher productivity.

  • Greatly enhances fine-feature printing
  • Combines a vacuum and solvent stroke into a single wiper stroke
  • Cuts stencil cleaning cycle times by 5 – 6 seconds over the standard wiper
  • Improves cleaning effectiveness
  • Reduces paper costs
  • Improves throughput
  • Increases uptime
  • Standard on Momentum 

SPI Print Optimizer

MPM’s SPI Print Optimizer is a process optimization tool that brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. Simply put, when the SPI machine ‘sees’ X, Y, and Theta offset problems on PCBs being printed, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

  • Increases first pass yields
  • Stabilizes the print process by correcting offsets; builds consistency
  • Fine pitch printing advantage, maximum stencil to board alignment
  • Less operator ‘tweaking’ since process is automated
  • Reduces set-up time; increases run time
  • Optimized deposition, for better solder joints

StencilVision

 

StencilVision utilizes texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. Wiper operation can be driven by the results obtained.

  • Detects solder paste seepage from apertures to stencil underside
  • Initiates underside stencil wiping sequence to remove contamination
  • Prevents print defects, contamination of PCB caused by dirty stencil underside
  • Efficient – initiates wiping only when needed
  • Ensures optimum stencil to board gasketing

Momentum Elite Printer

Advanced Inspection and SPC Tools

MPM’s patented printer-based Vision and Advanced Inspection System is a cost-effective way to verify print and paste deposit results. It’s flexible enough to handle the complete range of today’s most challenging components. It measures the amount of paste covering the target pad and compares it with the required coverage. It’s an effective way to eliminate print defects and increase overall yields faster, with accuracy as reliable as SPI systems but at a fraction of the cost.

  • Patented system
  • State-of-the-art camera
  • Advanced optics and lighting
  • Configurable down to device level
  • Ensures precise board-to-stencil alignment
  • Superb alignment and post-print inspection
  • 2D Inspection integrated directly into the printer

Automatic Pin Placement

Automatic Pin Placement is MPM’s patented tooling solution that uses the vision gantry to precisely place and remove tooling pins. The carousel holds 48 pins to match and support the largest board size. A standard grid for single sided boards or an exact pin placement for double sided boards can be developed. The vision system and a bare PCB are used to locate pin position relative to component layout, and the tooling configuration is saved with the recipe.

  • Simplifies initial setup and product changeover
  • Perfect for high mix
  • Software-controlled; reduces operator variability
  • Hard rigid tooling
  • Automatically places support pins in a programmed pattern
  • Vision system verification of pin location
  • Pins are automatically removed from the table and stored
  • Video teach capability with live camera view

Benchmark

Benchmark 4.0 software, for the Printer platforms, operates with the Windows 7 OS system and incorporates the familiar Benchmark GUI and functionality, with added improvements in feature function that come from using Windows 7. 4.0 also incorporates a unique, empowering new Open Software Architecture, OpenApps (Patent Pending). OpenApps creates new communication possibilities for easy two-way communication between the printer and an in-house MES. Speedline is the first SMT equipment company to offer open software architecture and all of the creative possibilities that it brings.

  • OpenApps™ Open Software Architecture
  • Your MPM Printer can ‘talk’ to your MES System
  • Functionality without custom development
  • Create your own apps
  • Windows 7 compatible

BridgeVision

 

The BridgeVision system is a patented method of analyzing bridge defects on circuit boards in the post-print inspection process. This innovative system utilizes texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

  • Finds bridging defects post-print – before they go to reflow
  • Patented contrast and texture-based technologies
  • Combines with SPC tools
  • Operates simultaneously with MPM’s 2D paste inspection

Camalot Inside

Camalot Inside consists of two dispense pumps integrated into one system within a printing machine. Camalot Inside provides ultimate flexibility, allowing the dispense of two different materials, or the same material (doubling dispense throughput speed) with two needle sizes to easily administer multiple dot sizes. Laser Z-sensing ensures precise dispense heights. Camalot Inside eliminates the need for hand dispensing for PCBs that need some dispensed material in conjunction with the solder paste printing process step.

  • Best of Both Worlds:  Print and Dispense
  • 2 Dispense Heads – twice the flexibility & productivity
  • Award-winning Camalot dispense technology
  • Powerful complement to the printing machine and process capability
  • Dispense different materials, e.g., adhesive and solder paste, concurrently

EdgeLoc

The EdgeLoc system securely holds the PCB in place during printing using a side snugging technique. Flippers engage to secure the board across the top edge, which ensures board flatness, and removes any warpage from the board. The Z tower raises the board to the programmed height based on board thickness, software-controlled snuggers clamp the board edge across entire length of the PCB, and then the flippers retract so that there is no interference with full board-to-stencil contact. This technique for securing a board delivers the best print quality and is the most adaptable system for the widest range of applications. 

  • Software-controlled snugger pressure
  • PCB thickness adjusted automatically
  • No manual setup
  • Holds board firmly - no top clamps
  • Optimal stencil to board gasketing
  • Highest paste transfer efficiency
  • Critical for thin PCB applications
  • Provides optimal stencil to board gasketing across the entire board
  • It eliminates paste volume inconsistency for components near the board edge
  • Reduces bleed-out and bridging.

EnclosedFlow

The MPM® EnclosedFlow™ Print Head is an enclosed print media technology that’s different from printing with squeegee blades. Solder paste is held within an enclosed chamber and pressurized during the print stroke to provide uniform aperture filling and superb printing performance especially for fine pitch devices, with less media waste. EnclosedFlow delivers superior volume/yield on fine pitch pads with up to 50% greater volume and 25% lower deviation than squeegee blades.

  • Tremendous savings on print media
  • Optimum aperture fill for fine pitch
  • Improved volume deposition
  • Tight process control of print process
  • Cleaning is fast and simple due to fewer parts
  • Fast changeover for high mix manufacturing
  • ‘smart’ compensation for PCB variables

GerberEZ Teach

 

GerberEZ Teach makes the industry’s most advanced inspection system more powerful and user-friendly. With its user-friendly tool bar and features like fast component identification, custom device, off angle, and device specific capabilities, GerberEZ Teach makes 2D inspection programming a point and click routine. Choose which devices to look for based on device type and complexity.

  • Import Gerber data into benchmark for 2D inspection
  • Fast component identification
  • Simple custom device teach
  • Speedline-specific toolbar
  • Special workflow task list
  • Device specific inspection criteria
  • Off-angle capability
  • Ability to save multiple output files in one workspace – ideal for top and bottom side.

Innovative EdgeLoc™ Tooling

EdgeLoc uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps.

Paste Height Monitor

The Paste Height Monitor is an effective, completely non-contact solution designed to prevent defects caused by inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to effectively and very accurately monitor the paste bead for volume consistency. The sensor is mounted on the back of the squeegee head and measures solder paste bead diameter during the front-to-rear stroke.

  • Avoid defects caused by inadequate paste deposition
  • Monitors paste roll diameter during the front-to-rear stroke
  • Automatically Dispenses Paste/Notifies Operator to Add Paste
  • Prevents defects caused by operators adding excessive paste
  • Recovery Wizard alerts operator to add paste manually
  • Recovery Wizard guides operator through the process
  • No mechanical contact with the stencil
  • Promotes greater print consistency

PrinTrack

 

Traceability in electronics manufacturing is more critical today than ever before.  Comprehensive product traceability is the key to maintaining product quality, consistency, and control over your manufacturing process.  It's also a requirement of many hi-reliability end users including Automotive, Smart Device, Industrial, DoD, Medical and hardened electronic OEMs.

MPM offers comprehensive product traceability powered by globally recognized Cogiscan.  MPM's PrinTrack focuses primarily on printing process parameters, solder paste and tooling , but can seamlessly integrate with other equipment and elements in the manufacturing cycle, e.g., MES, ERP, and can be expanded factory-wide.  PrinTrack enables you to track your printed products throughout the SMT assembly line through a simple user interface and flexible reporting.  With PrinTrack, you will always have a complete history detailing how your product was made, when it was made, the process parameters used to print it, and all pertinent information that can be used to track products or troubleshoot the process if needed.

RapidClean

RapidClean is a high speed stencil cleaning solution that improves stencil cleaning performance and reduces cycle time when using solvent. It’s a faster, more effective way of cleaning fine-pitch stencil apertures for better printing of fine pitch patterns and thus higher yields and fewer defects. It promotes less cleaning because the process is more efficient, reducing the number of cleaning cycles and cycle time for higher productivity.

  • Greatly enhances fine-feature printing
  • Combines a vacuum and solvent stroke into a single wiper stroke
  • Cuts stencil cleaning cycle times by 5 – 6 seconds over the standard wiper
  • Improves cleaning effectiveness
  • Reduces paper costs
  • Improves throughput
  • Increases uptime
  • Standard on Momentum 

RapidView Inspection

The RapidView Inspection option with a larger Field of View (FOV) camera delivers improved inspection functionality with the same depth of quality as our standard camera, but at substantially faster speeds. In fact, RapidView Inspection is the fastest printer-based inspection available on the market. Cutting cycle time for each board processed means higher throughput.

  • High-speed 2D inspection
  • Device-level SPC reporting
  • 3x Faster than standard system
  • 4x Field of View increase
  • Works with Gerber EZ Teach
  • Inspection speeds are not governed by device pitch or feature size
  • Inspection can be Device driven or Area driven

SPI Print Optimizer

MPM’s SPI Print Optimizer is a process optimization tool that brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. Simply put, when the SPI machine ‘sees’ X, Y, and Theta offset problems on PCBs being printed, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

  • Increases first pass yields
  • Stabilizes the print process by correcting offsets; builds consistency
  • Fine pitch printing advantage, maximum stencil to board alignment
  • Less operator ‘tweaking’ since process is automated
  • Reduces set-up time; increases run time
  • Optimized deposition, for better solder joints

StencilVision

 

StencilVision utilizes texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. Wiper operation can be driven by the results obtained.

  • Detects solder paste seepage from apertures to stencil underside
  • Initiates underside stencil wiping sequence to remove contamination
  • Prevents print defects, contamination of PCB caused by dirty stencil underside
  • Efficient – initiates wiping only when needed
  • Ensures optimum stencil to board gasketing

Momentum HiE Printer

Advanced Inspection and SPC Tools

MPM’s patented printer-based Vision and Advanced Inspection System is a cost-effective way to verify print and paste deposit results. It’s flexible enough to handle the complete range of today’s most challenging components. It measures the amount of paste covering the target pad and compares it with the required coverage. It’s an effective way to eliminate print defects and increase overall yields faster, with accuracy as reliable as SPI systems but at a fraction of the cost.

  • Patented system
  • State-of-the-art camera
  • Advanced optics and lighting
  • Configurable down to device level
  • Ensures precise board-to-stencil alignment
  • Superb alignment and post-print inspection
  • 2D Inspection integrated directly into the printer

Automatic Pin Placement

Automatic Pin Placement is MPM’s patented tooling solution that uses the vision gantry to precisely place and remove tooling pins. The carousel holds 48 pins to match and support the largest board size. A standard grid for single sided boards or an exact pin placement for double sided boards can be developed. The vision system and a bare PCB are used to locate pin position relative to component layout, and the tooling configuration is saved with the recipe.

  • Simplifies initial setup and product changeover
  • Perfect for high mix
  • Software-controlled; reduces operator variability
  • Hard rigid tooling
  • Automatically places support pins in a programmed pattern
  • Vision system verification of pin location
  • Pins are automatically removed from the table and stored
  • Video teach capability with live camera view

Benchmark

Benchmark 4.0 software, for the Printer platforms, operates with the Windows 7 OS system and incorporates the familiar Benchmark GUI and functionality, with added improvements in feature function that come from using Windows 7. 4.0 also incorporates a unique, empowering new Open Software Architecture, OpenApps (Patent Pending). OpenApps creates new communication possibilities for easy two-way communication between the printer and an in-house MES. Speedline is the first SMT equipment company to offer open software architecture and all of the creative possibilities that it brings.

  • OpenApps™ Open Software Architecture
  • Your MPM Printer can ‘talk’ to your MES System
  • Functionality without custom development
  • Create your own apps
  • Windows 7 compatible

BridgeVision

 

The BridgeVision system is a patented method of analyzing bridge defects on circuit boards in the post-print inspection process. This innovative system utilizes texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

  • Finds bridging defects post-print – before they go to reflow
  • Patented contrast and texture-based technologies
  • Combines with SPC tools
  • Operates simultaneously with MPM’s 2D paste inspection

Camalot Inside

Camalot Inside consists of two dispense pumps integrated into one system within a printing machine. Camalot Inside provides ultimate flexibility, allowing the dispense of two different materials, or the same material (doubling dispense throughput speed) with two needle sizes to easily administer multiple dot sizes. Laser Z-sensing ensures precise dispense heights. Camalot Inside eliminates the need for hand dispensing for PCBs that need some dispensed material in conjunction with the solder paste printing process step.

  • Best of Both Worlds:  Print and Dispense
  • 2 Dispense Heads – twice the flexibility & productivity
  • Award-winning Camalot dispense technology
  • Powerful complement to the printing machine and process capability
  • Dispense different materials, e.g., adhesive and solder paste, concurrently

EdgeLoc

The EdgeLoc system securely holds the PCB in place during printing using a side snugging technique. Flippers engage to secure the board across the top edge, which ensures board flatness, and removes any warpage from the board. The Z tower raises the board to the programmed height based on board thickness, software-controlled snuggers clamp the board edge across entire length of the PCB, and then the flippers retract so that there is no interference with full board-to-stencil contact. This technique for securing a board delivers the best print quality and is the most adaptable system for the widest range of applications. 

  • Software-controlled snugger pressure
  • PCB thickness adjusted automatically
  • No manual setup
  • Holds board firmly - no top clamps
  • Optimal stencil to board gasketing
  • Highest paste transfer efficiency
  • Critical for thin PCB applications
  • Provides optimal stencil to board gasketing across the entire board
  • It eliminates paste volume inconsistency for components near the board edge
  • Reduces bleed-out and bridging.

EnclosedFlow

The MPM® EnclosedFlow™ Print Head is an enclosed print media technology that’s different from printing with squeegee blades. Solder paste is held within an enclosed chamber and pressurized during the print stroke to provide uniform aperture filling and superb printing performance especially for fine pitch devices, with less media waste. EnclosedFlow delivers superior volume/yield on fine pitch pads with up to 50% greater volume and 25% lower deviation than squeegee blades.

  • Tremendous savings on print media
  • Optimum aperture fill for fine pitch
  • Improved volume deposition
  • Tight process control of print process
  • Cleaning is fast and simple due to fewer parts
  • Fast changeover for high mix manufacturing
  • ‘smart’ compensation for PCB variables

GerberEZ Teach

 

GerberEZ Teach makes the industry’s most advanced inspection system more powerful and user-friendly. With its user-friendly tool bar and features like fast component identification, custom device, off angle, and device specific capabilities, GerberEZ Teach makes 2D inspection programming a point and click routine. Choose which devices to look for based on device type and complexity.

  • Import Gerber data into benchmark for 2D inspection
  • Fast component identification
  • Simple custom device teach
  • Speedline-specific toolbar
  • Special workflow task list
  • Device specific inspection criteria
  • Off-angle capability
  • Ability to save multiple output files in one workspace – ideal for top and bottom side.

Innovative EdgeLoc™ Tooling

EdgeLoc uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps.

Paste Height Monitor

The Paste Height Monitor is an effective, completely non-contact solution designed to prevent defects caused by inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to effectively and very accurately monitor the paste bead for volume consistency. The sensor is mounted on the back of the squeegee head and measures solder paste bead diameter during the front-to-rear stroke.

  • Avoid defects caused by inadequate paste deposition
  • Monitors paste roll diameter during the front-to-rear stroke
  • Automatically Dispenses Paste/Notifies Operator to Add Paste
  • Prevents defects caused by operators adding excessive paste
  • Recovery Wizard alerts operator to add paste manually
  • Recovery Wizard guides operator through the process
  • No mechanical contact with the stencil
  • Promotes greater print consistency

PrinTrack

 

Traceability in electronics manufacturing is more critical today than ever before.  Comprehensive product traceability is the key to maintaining product quality, consistency, and control over your manufacturing process.  It's also a requirement of many hi-reliability end users including Automotive, Smart Device, Industrial, DoD, Medical and hardened electronic OEMs.

MPM offers comprehensive product traceability powered by globally recognized Cogiscan.  MPM's PrinTrack focuses primarily on printing process parameters, solder paste and tooling , but can seamlessly integrate with other equipment and elements in the manufacturing cycle, e.g., MES, ERP, and can be expanded factory-wide.  PrinTrack enables you to track your printed products throughout the SMT assembly line through a simple user interface and flexible reporting.  With PrinTrack, you will always have a complete history detailing how your product was made, when it was made, the process parameters used to print it, and all pertinent information that can be used to track products or troubleshoot the process if needed.

RapidClean

RapidClean is a high speed stencil cleaning solution that improves stencil cleaning performance and reduces cycle time when using solvent. It’s a faster, more effective way of cleaning fine-pitch stencil apertures for better printing of fine pitch patterns and thus higher yields and fewer defects. It promotes less cleaning because the process is more efficient, reducing the number of cleaning cycles and cycle time for higher productivity.

  • Greatly enhances fine-feature printing
  • Combines a vacuum and solvent stroke into a single wiper stroke
  • Cuts stencil cleaning cycle times by 5 – 6 seconds over the standard wiper
  • Improves cleaning effectiveness
  • Reduces paper costs
  • Improves throughput
  • Increases uptime
  • Standard on Momentum 

RapidView Inspection

The RapidView Inspection option with a larger Field of View (FOV) camera delivers improved inspection functionality with the same depth of quality as our standard camera, but at substantially faster speeds. In fact, RapidView Inspection is the fastest printer-based inspection available on the market. Cutting cycle time for each board processed means higher throughput.

  • High-speed 2D inspection
  • Device-level SPC reporting
  • 3x Faster than standard system
  • 4x Field of View increase
  • Works with Gerber EZ Teach
  • Inspection speeds are not governed by device pitch or feature size
  • Inspection can be Device driven or Area driven

SPI Print Optimizer

MPM’s SPI Print Optimizer is a process optimization tool that brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. Simply put, when the SPI machine ‘sees’ X, Y, and Theta offset problems on PCBs being printed, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

  • Increases first pass yields
  • Stabilizes the print process by correcting offsets; builds consistency
  • Fine pitch printing advantage, maximum stencil to board alignment
  • Less operator ‘tweaking’ since process is automated
  • Reduces set-up time; increases run time
  • Optimized deposition, for better solder joints

StencilVision

 

StencilVision utilizes texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. Wiper operation can be driven by the results obtained.

  • Detects solder paste seepage from apertures to stencil underside
  • Initiates underside stencil wiping sequence to remove contamination
  • Prevents print defects, contamination of PCB caused by dirty stencil underside
  • Efficient – initiates wiping only when needed
  • Ensures optimum stencil to board gasketing

MPM 100 Printer

Advanced Inspection and SPC Tools

MPM’s patented printer-based Vision and Advanced Inspection System is a cost-effective way to verify print and paste deposit results. It’s flexible enough to handle the complete range of today’s most challenging components. It measures the amount of paste covering the target pad and compares it with the required coverage. It’s an effective way to eliminate print defects and increase overall yields faster, with accuracy as reliable as SPI systems but at a fraction of the cost.

  • Patented system
  • State-of-the-art camera
  • Advanced optics and lighting
  • Configurable down to device level
  • Ensures precise board-to-stencil alignment
  • Superb alignment and post-print inspection
  • 2D Inspection integrated directly into the printer

Benchmark

Benchmark 4.0 software, for the Printer platforms, operates with the Windows 7 OS system and incorporates the familiar Benchmark GUI and functionality, with added improvements in feature function that come from using Windows 7. 4.0 also incorporates a unique, empowering new Open Software Architecture, OpenApps (Patent Pending). OpenApps creates new communication possibilities for easy two-way communication between the printer and an in-house MES. Speedline is the first SMT equipment company to offer open software architecture and all of the creative possibilities that it brings.

  • OpenApps™ Open Software Architecture
  • Your MPM Printer can ‘talk’ to your MES System
  • Functionality without custom development
  • Create your own apps
  • Windows 7 compatible

GerberEZ Teach

 

GerberEZ Teach makes the industry’s most advanced inspection system more powerful and user-friendly. With its user-friendly tool bar and features like fast component identification, custom device, off angle, and device specific capabilities, GerberEZ Teach makes 2D inspection programming a point and click routine. Choose which devices to look for based on device type and complexity.

  • Import Gerber data into benchmark for 2D inspection
  • Fast component identification
  • Simple custom device teach
  • Speedline-specific toolbar
  • Special workflow task list
  • Device specific inspection criteria
  • Off-angle capability
  • Ability to save multiple output files in one workspace – ideal for top and bottom side.

Paste Height Monitor

The Paste Height Monitor is an effective, completely non-contact solution designed to prevent defects caused by inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to effectively and very accurately monitor the paste bead for volume consistency. The sensor is mounted on the back of the squeegee head and measures solder paste bead diameter during the front-to-rear stroke.

  • Avoid defects caused by inadequate paste deposition
  • Monitors paste roll diameter during the front-to-rear stroke
  • Automatically Dispenses Paste/Notifies Operator to Add Paste
  • Prevents defects caused by operators adding excessive paste
  • Recovery Wizard alerts operator to add paste manually
  • Recovery Wizard guides operator through the process
  • No mechanical contact with the stencil
  • Promotes greater print consistency

PrinTrack

 

Traceability in electronics manufacturing is more critical today than ever before.  Comprehensive product traceability is the key to maintaining product quality, consistency, and control over your manufacturing process.  It's also a requirement of many hi-reliability end users including Automotive, Smart Device, Industrial, DoD, Medical and hardened electronic OEMs.

MPM offers comprehensive product traceability powered by globally recognized Cogiscan.  MPM's PrinTrack focuses primarily on printing process parameters, solder paste and tooling , but can seamlessly integrate with other equipment and elements in the manufacturing cycle, e.g., MES, ERP, and can be expanded factory-wide.  PrinTrack enables you to track your printed products throughout the SMT assembly line through a simple user interface and flexible reporting.  With PrinTrack, you will always have a complete history detailing how your product was made, when it was made, the process parameters used to print it, and all pertinent information that can be used to track products or troubleshoot the process if needed.

SPI Print Optimizer

MPM’s SPI Print Optimizer is a process optimization tool that brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. Simply put, when the SPI machine ‘sees’ X, Y, and Theta offset problems on PCBs being printed, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

  • Increases first pass yields
  • Stabilizes the print process by correcting offsets; builds consistency
  • Fine pitch printing advantage, maximum stencil to board alignment
  • Less operator ‘tweaking’ since process is automated
  • Reduces set-up time; increases run time
  • Optimized deposition, for better solder joints