The MPM® Momentum® Hi-E (for High Efficiency) is a single-rail printer superior throughput and cycle times. The HiE uses servo motors, rather than stepper motors to firve the vision system X, Y, and Z axes at higher speed.
Momentum HiE Printer
Machine vision inspection occupies a significant amount of time in each print cycle. Most of that involves the physical motion of system components. By speeding component motion, we shave away cycle time, increase efficiency, and accumulate savings.
Wet Print accuracy of 20µm@6σ, Cpk ≥ 2, with 6σ capability designed in and independently verified. The MPM Momentum series printers are fast, precise, and highly reliable, with performance unmatched by any other printer in their class.
The Momentum HiE incorporates expanded 2D inspection capabilities, featuring both the MPM patented contrast and texture-based technologies: BridgeVision™ and StencilVision™.
Powerful statistical process control (SPC) tools combine with these advanced vision and data acquisition technologies to facilitate maximum process analysis and optimization.
Automatic Pin Placement is a patented MPM tooling solution that uses the vision gantry to precisely place and remove pins. Pin patterns are software programmable ensures quick, easy and repeatable product changeover.
The ITW EAE's Benchmark software is powerful and intuitive: easy for the average operator to learn and to use. Benchmark software facilitates rapid set up, assists with operational tasks, and makes changeover quick and easy.
OpenApps architecture allows your MPM Printer to talk to your manufacturing execution system (MES) for increased functionality without custom development. ITW EAE (formerly Speedline) is the first SMT company to offer open software architecture.
Single axis, closed-loop pressure control for dual squeegee eliminates front-to-back variation. A single high precision load cell provides squeegee force, and a unique algorithm calibrates out non-linearity, maintaining the set pressure across the entire board surface.
Whether adding solder paste for components or epoxy for connectors, the Camalot Inside system ensures optimum dispense speeds while improving production line flexibility and productivity.
The EdgeLoc system uses software-controlled pressure for optimal board holding force. The EdgeLoc system automatically adapts to the programmed board thickness and firmly holds the board without the use of top clamps.
The EnclosedFlow print head offers significant process and cost advantages over printing with metal squeegee blades, particularly for fine-feature printing. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.
The EnclosedFlow print head delivers superior volume/yield on fine pitch pads. Print fine pitch features such as 01005s and 0.3 mm pitch CSPs with up to 50% greater volume and 25% lower deviation that squeegee blades. The EnclosedFlow print head ensures optimal aperture filling for fine pitch devices and crisp uniform printing with less waste.
MPM OpenApps features an open architecture source code which equips customers and third parties with the opportunity for developing custom interfaces in support of Industry 4.0 initiatives and Manufacturing Execution Systems (MES).
The paste height monitor is a robust solution that allows the user to monitor the paste roll size on the front squeegee blade during a print stroke.
The PrinTrack feature adds traceability, data harvesting, and reporting to your printing process. With PrinTrack, you always have an easy access to a comprehensive history, detailing:
- How your product was printed
- When it was printed
- The process parameters used to print the board
- All pertinent information that can be used to track products or troubleshoot the process if needed.
A flexible web reporting interface can be user-configured to produce traceability reports.
The RapidClean stencil cleaner is a high-speed stencil cleaning solution that improves cleaning performance and cuts cycle time. The RapidClean stencil cleaner provides precise wet/dry wipe transition and exceptional cleaning results with its paper over plenum design, venture vacuum, and patented roller solvent bar delivery system.
Built on our patented optics technology, RapidView system delivers high-speed 2D inspection with device-level SPC reporting. RapidView inspection is up to three and half times faster than our standard system, can increase Field of View (FOE) 4x, and can work in conjunction with our GerberEZ Teach system.
The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration on the fly to stay on target and prevent print defects.