The ZEVAm+ brings patented soldering technology that excels at meeting the challenges of miniaturization. Tilting allows the ZEVAm+ to solder at any angle to guarantee proper soldering results for the ever decreasing pitch of components. ZEVAm+ can process three PCBs simultaneously for high throughput in a high mix environment and offers a choice of wettable and non-wettable nozzles.
High frequency, high-speed, drop jet fluxing meets every cycle time and drop size requirement and increases the process window up to 5 times. Clogging is reduced with larger hole dimension of 180µm.