Selective Soldering Solutions
ZEVAm+ Selective Soldering Machine
The ZEVAm+ brings superior fine-pitch selective point-to-point soldering with Bridge Prevention Technology, non-wettable nozzles, and the ability to solder under an angle.
ZEVA's Bridge Prevention Technology acts as a hot nitrogen knife to ensure bridge-free soldering by preventing bridges from ever forming. The patented technology is designed to ensure stable wave dynamics and improve thermal solderability. Nitrogen temperature and velocity are separately adjustable. It is a critical feature for bridge-free fine-pitch soldering.
ZEVAm+ preheater station features bottom and optional top side quartz heaters. Optional closed loop preheater management ensures PCB temperature before soldering.
ZEVAm+ features point-to-point or drag soldering with a rotating nozzle to reduce cycle time. The electromagnetic moveable solderpot provides the option to solder under an angle.
Non-wettable Selectwave nozzles are maintenance-free and specially treated to eliminate erosion from lead-free solder. Non-wettable nozzles can be 3D printed out of stainless steel and hard chromized for infinitely long life. 3D printing allows unique shapes that are more stable and allow flexibility to run multiple rows of fine pitch connectors.
Overview
The ZEVAm+ selective soldering machine brings patented soldering technology that excels at meeting the challenges of miniaturization. Bridging is one of the biggest challenges for fine pitch soldering. ZEVA offers patented Bridge Prevention Technology that prevents bridges from ever forming. Bridge Prevention Technology enables the use of maintenance-free non-wettable nozzles for more consistent soldering results over time. Tilting allows the ZEVAm+ to solder at any angle to guarantee proper soldering results on ever more densely packed boards. ZEVAm+ can process three PCBs simultaneously for high throughput in a high mix environment. All this in the smallest possible footprint.
Featured Technology and Benefits
High frequency, high-speed, drop jet fluxing meets every cycle time and drop size requirement and increases the process window up to 5 times. Clogging is reduced with larger hole dimension of 180µm.
ZEVAm+ features a Selectwave solderpot for point-to-point or drag soldering with a rotating nozzle to reduce cycle time. The solderpot is covered to minimize nitrogen consumption and dross formation. A movable electromagnetic solderpot allows soldering under an angle.
- Standard offline programming software
- Program without using machine capacity
- Automatic snap function aligning program over through-hole
- Automatic calibration, process proposal, and flux volume calculation
- Uses .DXF, Gerber or pixel based input
Bridging is the leading cause of defects on boards with fine-pitch components. This patented tool acts as a hot nitrogen knife to prevent bridging for small pitch up to 1mm (40mil) pin to pin distance even with longer leads and increased drag speed. The tool is now integrated with a non-wettable nozzle that is 3D printed out of stainless steel and hard chromized for maintenance free, infinitely long life. This ensures the nitrogen flow has a fixed position to the wave for a highly repeatable bridge prevention process.
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Active and precise control of PCB temperature. with automatic adjustment of lamp power to reach desired temperature at the end of the preheat cycle. Improved process control and board to board repeatability with no additional cycle time.
Closed loop flux volume control is available for even greater consistency and traceability.
Lead-free solders will erode wettable nozzles which require you to exchange the nozzle tip frequently. The iron that is dissolved forms crystals which is polluting the solder alloy resulting in inconsistency. Wetted nozzles also require additional maintenance to maintain wettability.
Non-wettable Selectwave nozzles are maintenance-free and specially treated to eliminate erosion from lead-free solder. Non-wettable nozzles can be 3D printed out of stainless steel and hard chromized for infinitely long life. 3D printing allows unique shapes that are more stable and allow flexibility to run multiple rows of fine pitch connectors.
- Barcode integration allows automatically selection of correct program
- Management Information System saves all set and actual values of a specific soldered product into a log file
- Linking barcode and management information provides full traceability
- Connectivity to host computer and Manufacturing Execution Systems (MES)