ZEVAm+ Selective Soldering Machine
Overview
The ZEVAm+ selective soldering machine brings patented soldering technology that excels at meeting the challenges of miniaturization. Tilting allows the ZEVAm+ to solder at any angle to guarantee proper soldering results for the ever decreasing pitch of components. ZEVAm+ can process three PCBs simultaneously for high throughput in a high mix environment and offers a choice of wettable and non-wettable nozzles.
Benefits and Features
High frequency, high-speed, drop jet fluxing meets every cycle time and drop size requirement and increases the process window up to 5 times. Clogging is reduced with larger hole dimension of 180µm.

- Standard offline programming software
- Program without using machine capacity
- Automatic snap function aligning program over through-hole
- Automatic calibration, process proposal, and flux volume calculation
- Uses .DXF, Gerber or pixel based input
Enhanced Technology

SDC (Solder Drainage Conditioner) acts as a hot nitrogen knife to ensure bridge-free soldering. The patented SDC tool is designed to ensure stable wave dynamics and improve thermal solderability. Nitrogen temperature and velocity are separately adjustable. SDC is a critical feature for robust fine-pitch soldering. Click here to watch SDC video


Active and precise control of PCB temperature. with automatic adjustment of lamp power to reach desired temperature at the end of the preheat cycle. Improved process control and board to board repeatability with no additional cycle time.

- Barcode integration allows automatically selection of correct program
- Management Information System saves all set and actual values of a specific soldered product into a log file
- Linking barcode and management information provides full traceability
- Connectivity to host computer and Manufacturing Execution Systems (MES)


Integrated mass flow meter has capability to measure during the whole flux cycle directly in the supply circuit to the nozzle.