Achieving Repeatable, Consistent Control Over the Selective Production Process

Selective soldering machines are available in many different configurations, primarily because the assemblies are very different, not only in design, width, mass, but also in volume and in the number of solder joints.

Nevertheless, they all require the same three sub-processes of fluxing, preheating and soldering. These processes can have different methods, but in the end all main parameters are identical to create a solder connection: the amount of flux per area, preheat temperature, solder temperature, and contact time.

Forced convection reflow is the preferred method of SMT reflow soldering of surface mounted components to a printed circuit board (PCB) today. The oven is typically separated into zones in which each zone is independently controlled to optimize the thermal profile of the oven’s process zone.
Reflow SolderingSince their introduction in 1990, virtually all of the Vitronics Reflow systems supplied are still in operation. With thousands of systems in operation worldwide, they provide unmatched reliability that is the benchmark for the industry.
VItronics Soltec and Electrovert have developed a range of forced convection ovens designed specifically for curing applications.