Advances in Fine Pitch Printing Process Technology

Abstract

Increasingly fine pitch component patterns on PCBs, and ever-smaller passive components such as 03015’s continue to narrow the process window for PCB assemblers. The drive toward ever-finer pitches is driven by a number of factors, particularly miniaturization in mobile devices such as Smartphones, where consumers are demanding greater functionality in compact, hand-held devices. As a result, material handling and component placement becomes more difficult, and solder paste printing is especially impacted.

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Stainless steel foil stencils are used to print solder paste and adhesives on bare PCBs. Stencils of varying thickness, and also ‘step’ stencils with varying thicknesses in specific areas for different deposition requirements are used.
Solder Paste, a complex mixture of tiny particles of solder alloy and flux vehicle, is a challenging material to print onto a bare Surface Mount Technology (SMT) PCB.
Traditional metal screens excel in the printing of many electronic materials on rigid and flexible PCBs. These materials include solder masks and resists, fluxes and solder pastes, and especially conductive inks (silver, carbon, silver chloride), and dielectric inks, both used to form conductive traces, capacitor and resistor elements.
MPM stencil printers pioneered Surface Mount Technology (SMT) solder paste printing and continue to lead the industry in performance and excellence in printing electronic materials, including SMT Solder Paste.
PrintingMPM printers are high-speed, high-precision systems for depositing precise patterns of solder paste on printed circuit boards through foil stencils. Available in a wide range of capabilities.Best-in-class printing performance has always neen a hallmark of MPM printing technology, the recognized world standard for reliability, throughput, and high yields.