Bridge Detection in the Solder Paste Print Process

Abstract

The techniques described have proven to be robust and particularly well suited for detecting troublesome bridge and bridge-like features that span the gap between pads. This paper describes part of a research effort currently under way in the field of print defect detection.

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Stainless steel foil stencils are used to print solder paste and adhesives on bare PCBs. Stencils of varying thickness, and also ‘step’ stencils with varying thicknesses in specific areas for different deposition requirements are used.
Solder Paste, a complex mixture of tiny particles of solder alloy and flux vehicle, is a challenging material to print onto a bare Surface Mount Technology (SMT) PCB.
Traditional metal screens excel in the printing of many electronic materials on rigid and flexible PCBs. These materials include solder masks and resists, fluxes and solder pastes, and especially conductive inks (silver, carbon, silver chloride), and dielectric inks, both used to form conductive traces, capacitor and resistor elements.
MPM stencil printers pioneered Surface Mount Technology (SMT) solder paste printing and continue to lead the industry in performance and excellence in printing electronic materials, including SMT Solder Paste.
PrintingMPM printers are high-speed, high-precision systems for depositing precise patterns of solder paste on printed circuit boards through foil stencils. Available in a wide range of capabilities.Best-in-class printing performance has always neen a hallmark of MPM printing technology, the recognized world standard for reliability, throughput, and high yields.