With the growing demand of Semiconductor Advanced Packaging and miniaturization in electronic assembly industry, a much more controlled and automated process with tighter tolerance levels and increased units per hour (UPH) is required.
Camalot Dispensers Technical Papers
Today’s automated dispensing for electronics manufacturing is a complex and precise process in order to meet the challenges posed by ever more demanding assembly and component technology requirements. Dedicated dispenser technology is key to success in meeting challenging applications in a production environment with precision and repeatability.
Automated dispensing of electronic fluids is employed across the full range of electronics manufacturing, from board-level assembly to semiconductor applications.
A new process has been developed for RF shielding on compact electronic communications devices using automated solder paste dispensing. The process is known as Shield Edge Interconnect (SEI). SEI designs enable parts to be processed though underfill before placing of the RF shield and allows more complete use of valuable PCB real estate to achieve reduced form factor requirements and/or for added components on products such as smartphones and tablets.