Technical Papers

Under stencil wiping is the first defense against defects. Matching the wiper profile and frequency to the indivudla boards, where one size does not fit all.
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components...
The number of through-hole components on printed circuit boards (PCB) has declined significantly over the last decade. Miniaturization in electronics has...
Flux is one of the most critical parameters in the selective soldering process. Flux deposition on the board needs to be carefully controlled. It should have...
One of the major trends in circuit board assembly is the drive to smaller components and pitches. Where the focus is on SMD (Surface Mount Devices) and also...
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free...
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole)...
Selective soldering is a process with more than one hundred different parameters that may impact soldering performance. Some conditions change over time, e.g....
Three ingredients are required to make a good solder joint: solder, clean metal surfaces to connect and heat. In a selective soldering process all three have a...
Miniaturization continues in all kind of electronic assemblies and thus also in the different soldering processes. Not only consumer electronic assemblies...
An inert atmosphere opens the reflow process window. Reflow ovens that have a Nitrogen environment may have better yields because of the lack of oxidation...
Selective soldering, along with pin-in-paste reflow and press fit, is the primary assembly method for through-hole components. The reflow process is limited by...
Although the number of Through Hole (THT) connections the electronics assemblies is decreasing due to miniaturization, selective soldering is still a growing...
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of...
Cleaning electronic assemblies, or PCBs (Printed Circuit Boards), has been essential for many years. As PCB board density has increased and standoff height has...