MPM Printers Technical Papers

Stencil Printing 008004/0201 Aperture Components

Stencil Printing 008004/0201 Aperture Components

This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore’s law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors.

Paste in Hole (PIH) Printing with an Enclosed Media Solution

Paste in Hole (PIH) Printing with an Enclosed Media Solution

Paste-in-Hole (PIH) printing, a.k.a. through-hole printing, pin-in-paste, intrusive reflow, etc., has always been a way to accommodate traditional through-hole components on a mixed-technology SMT assembly using reflow soldering rather than wave to make the through-hole connections. Paste is printed in such a manner to as to fill the through-holes, the through-hole components are inserted, and the assembly is reflowed.