Thermal Curing

ITW EAE  has developed a range of forced convection ovens designed specifically for curing applications. 

The Vitronics Soltec and Electrovert curing ovens are applicable to the following:

  • Curing of SMT adhesives, epoxies, TIMs, etc.;
  • Solar (PV) Curing;
  • Pre-bake for underfill;
  • Special applications and materials.
Forced convection reflow is the preferred method of SMT reflow soldering of surface mounted components to a printed circuit board (PCB) today. The oven is typically separated into zones in which each zone is independently controlled to optimize the thermal profile of the oven’s process zone.
Reflow SolderingSince their introduction in 1990, virtually all of the Vitronics Reflow systems supplied are still in operation. With thousands of systems in operation worldwide, they provide unmatched reliability that is the benchmark for the industry.