Cleaning for Semiconductor and wire bonding

In the semiconductor and electronics manufacturing industries, enhanced reliability continues to be a focus of manufacturers and cleaning is seen as a solution. Electrovert in-line and MicroCel batch cleaning systems have provided manufacturers with effective cleaning solutions.

Just recently, the Electrovert Aquastorm 200 in-line PCB cleaner was used for cleaning assemblies in the mobile phone and semiconductor manufacturing industries in high-volume manufacturing environments. The MicroCel centrifugal cleaning system is being used for defluxing and surface preparation (removing oxidation) in the semiconductor industries.

In all cases, Electrovert has become the preferred partner. Electrovert’s advantage is in sharing product and process expertise to develop long-term solutions that are backed by a world-class global support network.

The Electrovert Aquastorm in-line and MicroCel batch cleaners are used for many cleaning applications:

  • PCB assembly;
  • Defluxing;
  • Smartphone and Tablet assembly;
  • Microelectronics;
  • Semiconductor;
  • Hybrid electronics;
  • Misprint cleaning;
  • Industrial parts cleaning;
  • Wet cleaning prior to wire bonding;
  • Specialty applications.
Electrovert® Aquastorm™ precision cleaning systems provide superior cleaning and drying performance, complete cleaning process flexibility, process monitoring, and reliability.
The Electrovert® Aquastorm™ series precision cleaning machines are designed to provide superior cleaning and drying performance, complete cleaning process flexibility and monitoring, all with unparalleled reliability.
As the value of double-sided PCB assemblies continue to rise, it becomes increasingly important for manufacturers to be able to recoup their cost from the assembly when a misprint occurs on the B-side (A-side was successfully printed and components placed and soldered, and when a misprint occurs during the printing process on the B-side).
The Electrovert® Aquastorm™ series precision cleaning machines are designed to provide superior cleaning and drying performance, complete cleaning process flexibility and monitoring, all with unparalleled reliability.
In-line cleaning is a method of cleaning in which assemblies are processed continuously on a conveyor system and cleaning cycle times are controlled by the conveyor speed.
Drying is the process of removing any residual liquid from the surfaces of washed and rinsed parts. Drying is a critical and expensive stage of the cleaning process, especially for PCB assemblies. The importance of drying is determined by post-cleaning process step requirements.
As high reliability printed circuit boards become more dense and complex, PCB assemblers are seeking ways to enhance reliability. Cleaning is viewed as a process solution. Defluxing is the cleaning process designed to remove solder flux and by-products from the PCB assembly.
In the semiconductor and electronics manufacturing industries, enhanced reliability continues to be a focus of manufacturers and cleaning is seen as a solution.
Batch cleaning is the process of cleaning multiple parts or ‘batches of parts’ as a group where process cycle times are controlled. Batch type cleaners are used in numerous applications throughout the entire semiconductor manufacturing and PCB assembly industries.