Solder Paste Printing

Solder Paste printing, a complex mixture of tiny particles of solder alloy and flux vehicle, is a challenging material to print onto a bare Surface Mount Technology (SMT) PCB. Solder paste printed deposits are essential to forming defect-free solder joints, the electrical and physical connections between electronic components and the PCB assembly. MPM printers excel in printing crisp, accurate, defect-free deposits of solder paste through metal foil stencils onto PCBs with consistent results every time, shift after shift, board after board, with precise, repeatable results. MPM printers deliver a repeatable paste printing process that ensures high product quality, robustness, and in-the-field reliability for the widest range of SMT assembly applications, from Hi-rel Military to consumer and commercial/industrial electronic devices.

Stencil Printing Machines:
Edison Stencil Printer | Momentum II Elite Stencil Printer | Momentum II HiE Stencil Printer  
Momentum II BTB Stencil Printer | Momentum II 100 Stencil Printer

MPM printers are high-speed, high-precision systems for depositing precise patterns of solder paste on printed circuit boards through foil stencils. Available in a wide range of capabilities.

Best-in-class printing performance has always been a hallmark of MPM printing technology, the recognized world standard for reliability, throughput, and high yields.

Traditional metal screens excel in the printing of many electronic materials on rigid and flexible PCBs. These materials include solder masks and resists, fluxes and solder pastes, and especially conductive inks (silver, carbon, silver chloride), and dielectric inks, both used to form conductive traces, capacitor and resistor elements.

MPM stencil printers pioneered Surface Mount Technology (SMT) solder paste printing and continue to lead the industry in performance and excellence in printing electronic materials, including SMT Solder Paste.

Stainless steel foil stencils are used to print solder paste and adhesives on bare PCBs. Stencils of varying thickness, and also ‘step’ stencils with varying thicknesses in specific areas for different deposition requirements are used.