For most people the reflow process is like a black box where the Printed Circuit Board goes in, and it comes out with soldered connections. The reflow profile is a critical aspect of the soldering process. It defines the temperature and time settings that a PCB goes through in a reflow oven.

Understanding the differences and implications of each approach is crucial for optimizing your cleaning process to meet specific operational needs and industry standards.

Sept. 4 - 6, 2024 Taipei, Taiwan

ITW EAE has released a new innovative option for the Electrovert Wave Soldering machines that provides the ability to pump up to a 20 mm wave height.

ITW EAE, the Electronic Assembly Equipment division of Illinois Tool Works, announces a new partnership agreement with Foster Innovative Technology, LLC (FIT) to further expand its representation and distribution network.

ITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.

ITW EAE will be showcasing its latest developments at IPC APEX, April 9 - 11 in Anaheim.

ITW EAE’s patented feature for the Electrovert Wave Soldering machines that provides automatic adjustment of the laminar wave flow to match the board velocity.

MPM® announces the new Edison™ II ACT stencil printer a simple to use, easy to adopt and scalable solution for automation.

Camdenton, Missouri, October 19, 2023 – As the industry expands rapidly, manufacturers require conveyor systems that can handle higher volumes and accommodate various soldering applications. The Heavy-Duty Finger Conveyor option being introduced by Electrovert is designed to address the increasing demands of PCB production in terms of throughput capability and process flexibility.