The MPM® Momentum® II BTB™ (Back to Back) configurable stencil printer allows dual-lane processing for higher throughput but without increasing either line length or capital investment. The Momentum II BTB stencil printer is the most flexible printer in the Momentum II machine.
Momentum II BTB Stencil Printer
The Momentum II BTB printer is a space-saving 200 mm shorter than the standard Momentum II printer. Configure for dual-lane processing by positioning two BTB printers back-to-back in a manufacturing line. Dual-lane processing generates the output of two printers in the length of one.
Use the MPM printer in-line as a stand-alone or configure back-to-back for dual-lane output. Print multiple products in a single SMT line, for example, print top and bottom sides, print the same side, or print mother/daughter boards. The Momentum II BTB printer comes in two different throughput configurations for optimum flexibility in line balancing.
The Momentum II BTB printer allows total front-side accessibility and service, with open access to the electrical system, solvent reservoir, and other key components. Because the BTB printer requires no read access or extra buffer space, position each printer to maximize your facility floor space.
Alignment repeatability of ±11 microns @ 6 sigma, Cpk ≥2 and wet Print accuracy of 17µm@6σ, Cpk ≥ 2, with 6σ capability designed in and independently verified. The MPM Momentum II series printers are fast, precise, and highly reliable, with performance unmatched by any other printer in their class.
Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.
AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.
Provides the flexibility to handle all stencil sizes with a simple adjustment of the shelf. The robust design provides better stability on all stencil sizes.
Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.
BridgeVision is a patented method of analyzing bridge defects on circuit boards in the post-print inspection process. This innovative system utilizes texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.
StencilVision utilizes texturebased technology to check the underside of a stencil for solder paste contamination. Wiper operation can be driven by the results obtained.
The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.
The MPM EnclosedFlow Print Head delivers uniform aperture filling and superb printing performance especially for fine pitch devices, with tremendous savings on solder paste over squeegee blade printing – in excess of 50% over blades for dramatically fast ROI. Printing fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than metal blades.
MPM’s patented printer based Vision and Inspection system is a cost-effectiveway to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.
MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.
The Paste Height Monitor is designed to prevent defects caused by inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.
Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent-pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.
PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.
New quick release squeegee blades makes changing blades quick and easy with no tools required. It takes less than 30 seconds to change the blade.
RapidClean is a high-speed stencil solvent cleaning innovation that slashes cycle time and improves stencil cleaning performance. RapidClean can save up to $10K USD per nnum in paper savings per printer.
SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.