Of the many flux products developed for soldering applications, most electronics assemblers prefer to use no-clean, low solids formulations, in part because they eliminate the post-reflow cleaning or defluxing process step.
Virtually all fluxes are designed to perform multiple functions:
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Chemical:
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Clean the surface to be soldered to allow wetting;
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Function as a chemical blanket over the surfaces to be soldered, thereby preventing oxidation during heating;
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Physical:
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Reduce surface tension of the molten solder, thereby enabling the solder to flow and wet solderable surfaces;
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Thermal:
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Facilitate the transfer of heat to solderable surfaces.
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The Electrovert® Electra™, VectraElite™, and VectraES™ all offer fluxing solutions for multiple applications and processes:
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ServoJet™: Design utilizes multiple spray jet technologies that maximize upward force, providing excellent topside penetration and precision flux deposition control. Its features include:
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Precision selective fluxing;
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OA version for aggressive fluxes;
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Dual head version for recipe controlled dual flux capability.
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ServoSpray™: Design utilizes an air-atomized single spray nozzle technology that provides a value-based fluxing solution. Its features include:
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Excellent flux deposition;
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Selective fluxing capability;
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Dual head version for recipe controlled dual flux capability.
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ServoSonic™: Design utilizes ultrasonic atomizer air delivery technology. Its features include:
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All wetted nozzle parts are titanium;
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Technology works well with high solid fluxes;
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Selective fluxing capability.
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