Fluxing Applications

Of the many flux products developed for soldering applications, most electronics assemblers prefer to use no-clean, low solids formulations, in part because they eliminate the post-reflow cleaning or defluxing process step.

Virtually all fluxes are designed to perform multiple functions:

  • Chemical:

    • Clean the surface to be soldered to allow wetting;

    • Function as a chemical blanket over the surfaces to be soldered, thereby preventing oxidation during heating;

  • Physical:

    • Reduce surface tension of the molten solder, thereby enabling the solder to flow and wet solderable surfaces;

  • Thermal:

    • Facilitate the transfer of heat to solderable surfaces.

The Electrovert® Electra™VectraElite™, and VectraES™ all offer fluxing solutions for multiple applications and processes:

  • ServoJet™: Design utilizes multiple spray jet technologies that maximize upward force, providing excellent topside penetration and precision flux deposition control. Its features include:

    • Precision selective fluxing;

    • OA version for aggressive fluxes;

    • Dual head version for recipe controlled dual flux capability.

  • ServoSpray™: Design utilizes an air-atomized single spray nozzle technology that provides a value-based fluxing solution. Its features include:

    • Excellent flux deposition;

    • Selective fluxing capability;

    • Dual head version for recipe controlled dual flux capability.

  • ServoSonic™: Design utilizes ultrasonic atomizer air delivery technology. Its features include:

    • All wetted nozzle parts are titanium;

    • Technology works well with high solid fluxes;

    •  Selective fluxing capability.

Wave Soldering Machines:
DeltaX Wave Solder Electra Wave Solder 
VectraElite Wave Solder VectraES Wave Solder

As board assemblies become increasingly complex and difficult to solder, board manufacturers are looking for wave solder machines that can provide closed-loop process control and automatic features.
In the demanding environment of lead-free soldering, it is important to understand the different characteristics of lead-free materials. Wetting times for lead-free alloys are slower than those of tin/lead, and flow characteristic are more viscous.
As PCB designs become more complex, thicker, and denser, through-hole soldering is becoming more difficult. The introduction of lead-free alloys compounds these problems because lead-free alloys don’t wet as well as lead-bearing alloys, and deeper holes (due to PCB thickness) make thorough hole-filling less certain in many cases.
As the complexity of PCB assemblies continues to increase, many electronics assemblers are seeking a solution in a wave soldering machine.
Wave SolderingAward-winning wave soldering technologies have long met the demanding throughput and process control challenges of applications such as lead-free wave soldering.
Even though most SMT soldering is achieved through reflow, some assemblies require that some of the Surface Mounted Devices (SMDs) on a board, such as chip components, must be wave soldered.