Fluxing Applications

Of the many flux products developed for soldering applications, most electronics assemblers prefer to use no-clean, low solids formulations, in part because they eliminate the post-reflow cleaning or defluxing process step.

Virtually all fluxes are designed to perform multiple functions:

• Chemical:

  • Clean the surface to be soldered to allow wetting;

  • Function as a chemical blanket over the surfaces to be soldered, thereby preventing oxidation during heating;

• Physical:

  • Reduce surface tension of the molten solder, thereby enabling the solder to flow and wet solderable surfaces;

• Thermal:

  • Facilitate the transfer of heat to solderable surfaces.

The Electrovert® Electra™, VectraElite™, and VectraES™ all offer fluxing solutions for multiple applications and processes:

• ServoJet™: Design utilizes multiple spray jet technologies that maximize upward force, providing excellent topside penetration and precision flux deposition control. Its features include:

  • Precision selective fluxing;

  • OA version for aggressive fluxes;

  • Dual head version for recipe controlled dual flux capability.

• ServoSpray™: Design utilizes an air-atomized single spray nozzle technology that provides a value-based fluxing solution. Its features include:

  • Excellent flux deposition;

  • Selective fluxing capability;

  • Dual head version for recipe controlled dual flux capability.

• ServoSonic™: Design utilizes ultrasonic atomizer air delivery technology. Its features include:

  • All wetted nozzle parts are titanium;

  • Technology works well with high solid fluxes;

  •  Selective fluxing capability.