Of the many flux products developed for soldering applications, most electronics assemblers prefer to use no-clean, low solids formulations, in part because they eliminate the post-reflow cleaning or defluxing process step.
Virtually all fluxes are designed to perform multiple functions:
-
Chemical:
-
Clean the surface to be soldered to allow wetting;
-
Function as a chemical blanket over the surfaces to be soldered, thereby preventing oxidation during heating;
-
-
Physical:
-
Reduce surface tension of the molten solder, thereby enabling the solder to flow and wet solderable surfaces;
-
-
Thermal:
-
Facilitate the transfer of heat to solderable surfaces.
-
The Electrovert® Electra™, VectraElite™, and VectraES™ all offer fluxing solutions for multiple applications and processes:
-
ServoJet™: Design utilizes multiple spray jet technologies that maximize upward force, providing excellent topside penetration and precision flux deposition control. Its features include:
-
Precision selective fluxing;
-
OA version for aggressive fluxes;
-
Dual head version for recipe controlled dual flux capability.
-
-
ServoSpray™: Design utilizes an air-atomized single spray nozzle technology that provides a value-based fluxing solution. Its features include:
-
Excellent flux deposition;
-
Selective fluxing capability;
-
Dual head version for recipe controlled dual flux capability.
-
-
ServoSonic™: Design utilizes ultrasonic atomizer air delivery technology. Its features include:
-
All wetted nozzle parts are titanium;
-
Technology works well with high solid fluxes;
-
Selective fluxing capability.
-
Wave Soldering Machines:
DeltaX Wave Solder | Electra Wave Solder
VectraElite Wave Solder | VectraES Wave Solder