Advanced packaging and component miniaturization are putting increasingly complex demands on semiconductor manufacturing that pushes the limits of electronic assembly equipment. Developments in flip chip packaging, advanced fan-out packages (FOWLP), System in Package technologies and 3D stacking are being developed to meet next generation market requirements. ITW EAE works with the world’s leading semiconductor manufacturers in developing equipment that addresses evolving technical challenges while also meeting the need for higher throughput, yield and performance.
Printing: MPM stencil printers provide the precision and accuracy needed for semiconductor manufacturing. Stencil printing of solder paste, flux, and other materials for advanced semiconductor packaging applications such wafer bumping, CSPs, BGAs, flip chips and SIPs has been proven as an effective, low cost solution. MPM Edison is optimized for ultra-fine pitch printing with a transfer efficiency that exceeds requirements for micro-thin stencil apertures. The Edison is the most accurate printer in the market with proven print process capability greater than 2 Cpk for 0201 metric components. Thin substrate printing is supported with a dedicated vacuum system and an ultra-tight coplanarity between the stencil and the substrate to ensure consistent print quality. A ready-made SECS/GEM interface is available for the Edison printer.
Dispensing: Camalot offers high-speed, extremely accurate dispensing of underfill and encapsulation molding, epoxy adhesives, polymers, photoresist, and flux. The Prodigy dispenser addresses the need for increased throughput with the Dynamic Dual Head (DDH). It allows synchronous dispensing with two pumps regardless of part-to-part rotation. A variety of high-speed pumps are available to suit the application. Closed-loop monitoring of the substrate temperature ensures process stability and yield improvements for underfill applications. The platform design is Semi S2/S8 complaint and can also meet Class 1000 cleanroom requirements by request.
Reflow soldering: The Centurion™ is a forced convection reflow system for reflow of ball mounts (bumping) with tight, closed-loop process control. The patented CATHOX™ (Catalytic Thermal Oxidizer) dramatically reduces maintenance requirements while keeping a clean process environment that is critical for Semiconductor processing. It is very effective in removing volatile compounds from the process tunnel during reflow. In thermal oxidation, organic vapors are converted to hydrocarbons, which are captured by a filter. With the best heat transfer in the industry, the Centurion can run any profile at the lowest set point possible, which minimizes the thermal differences over the product and uses less energy.
Cleaning: Electrovert cleaning equipment plays a critical role in semiconductor fabrication and are utilized in multiple steps, including degreasing, cleaning prior to electroplating and underfill, cleaning after bumping and wire bonding, and carrier debonding of fan-out packages. Cleaning helps to remove flux residue, excess adhesive, grease and oils to ensure proper bonding and material distribution and avoid defects and increase yields. Electrovert cleaners are designed to deal with small, lightweight semiconductor products such as lead frames, BGAs, wafers and 3D stacked packages. The Aquastorm delivers a small spray-jet mist that is less than 40 PSI. It delivers a dynamic combination of chemistry, thermal, and mechanical forms of energy at the surface to effectively clean under low stand-off and difficult to clean components. The MicroCel cleaner uses centrifugal energy for unparalleled penetration, solubilization and containment removal for advanced packages including flip chips, MCMs, SIPs, BGAs, CSPs, and hybrid electronics.
Thermal Processing: Despatch ovens provide clean process, low oxygen, fast cycle curing of adhesives and polymers used in high-volume semiconductor packaging and assembly. Despatch ovens have superior temperature uniformity of ± 0.5% of setpoint and offer SEMI S2/S8, CE, and SECS/GEM communication. Low particulate environmental controls protect from contamination and low oxygen levels prevent oxidation. Despatch ovens are used for adhesive bonding and curing, encapsulant curing, underfill curing of CMOS optical sensors, die attach and BGA, B-stage adhesive curing, polyimide curing, metallic thin film annealing, and photoresist curing.