Dam & Fill Encapsulation

Camalot® dispensing machines’ ability to precisely dispense both materials at high speed using dual head technology delivers high throughput and efficiency in dam and fill applications. Dam and fill is a method of fully encapsulating wire bonded die. It’s a two-part process, wherein a dam is dispensed first around the periphery of the top of the component, followed by filling the center.

Superior pump technology is the key to accurate and repeatable precision dispensing, Camalot owns and designs all of the pumps offered on our systems. These proprietary pump technologies are fully integrated within the motion control system and driven by innovative software controls to create a robust dispense process. Closed-loop control provided by a weight scale and vision inspection techniques facilitates a “hands off” setup and allows a continuous means to monitor and maintain the tightest of process requirements.

DispensingFor decades, Camalot® has been the global leader in dispensing technology for electronic materials. From board-level assembly to advanced packaging to cutting-edge compound semiconductors, Camalot’s innovative solutions have kept our dispense systems solutions in the forefront.
Camalot® dispensing machines excel in the precise, highly accurate micro-dispensing of conductive adhesives and epoxy resins onto a variety of surfaces including silicon, silver, gold and copper.
Camalot® precision dispense technology ensures successful application of adhesives for both corner and edge bonding processes. Edge and corner bonding are used as an alternative to underfill to add mechanical strength and reliability to BGAs and similar chip-scale packages (CSPs) and to increase reliability for drop testing.
Selective automated flux dispensing is utilized at certain stages in the assembly process where improved reliability and speed are required. Many applications include rework.
Camalot’s advanced time/pressure dispensing technology precisely and consistently applies curable RTV gasketing fluids for a wide range of applications such as automotive electronics and aerospace where a robust form-in-place (FIP) gasket is required to provide environmental isolation for electronic components and assemblies.
Camalot® dispensing machines incorporate the most advanced deposition technology for solder paste, traditionally one of the most difficult materials to dispense consistently.
Surface Mount Adhesives (SMA’s) are typically used to hold SMT components in place on the bottom side of a PCB. These can range from small ‘chip’ components to large devices. The adhesive, usually in highly visible yellow or red colors, is dispensed typically in dot form and is heat-curable.
Thermal Interface Materials (TIMs) are often curable higher-viscosity fluids designed to conduct heat from one object to another. Typically, they are sandwiched between a heat-generating surface and the surface of a heat sink.
Underfill is used in a wide variety of packages and board-level assemblies, and Camalot® dispense machines, particularly the SmartStream® pump technology, perform fast, efficient, complete underfill for all types of packages reliably and repeatably.
UV-curable selective coatings can be precisely applied to critical areas of electronic components and assemblies using Camalot® dispense technology including SmartStream, a unique patented non-contact pump technology.