Stencil Printing

MPM® printers deliver superior results with today’s advanced metal foil stencils. Whether stencils are chemical or laser etched, conventional or stepped, standard or fine pitch, MPM printing technology with advanced-design metal squeegee blades or the EnclosedFlow™ print head achieves superior results with all electronic materials, from solder paste to silicones. Recognized worldwide for precision solder paste deposition on PCBs, MPM printers deliver fewer print defects and optimum aperture fill with the finest feature printing. Superb results are achieved with all types of solder paste, including lead-free and traditional tin/lead formulations, and all particle sizes for defect-free deposition and optimum aperture fill.

Stencil Printing Machines:
Edison Stencil Printer | Momentum II Elite Stencil Printer | Momentum II HiE Stencil Printer  
Momentum II BTB Stencil Printer | Momentum II 100 Stencil Printer

MPM printers are high-speed, high-precision systems for depositing precise patterns of solder paste on printed circuit boards through foil stencils. Available in a wide range of capabilities.

Best-in-class printing performance has always been a hallmark of MPM printing technology, the recognized world standard for reliability, throughput, and high yields.

Traditional metal screens excel in the printing of many electronic materials on rigid and flexible PCBs. These materials include solder masks and resists, fluxes and solder pastes, and especially conductive inks (silver, carbon, silver chloride), and dielectric inks, both used to form conductive traces, capacitor and resistor elements.

MPM stencil printers pioneered Surface Mount Technology (SMT) solder paste printing and continue to lead the industry in performance and excellence in printing electronic materials, including SMT Solder Paste.

Solder Paste printing, a complex mixture of tiny particles of solder alloy and flux vehicle, is a challenging material to print onto a bare Surface Mount Technology (SMT) PCB.