Batch cleaning

Batch cleaning is the process of cleaning multiple parts or ‘batches of parts’ as a group where process cycle times are controlled. Batch type cleaners are used in numerous applications throughout the entire semiconductor manufacturing and PCB assembly industries.

Within the PCB assembly industry, some of the challenges facing assemblers include higher density, increased complexity, and miniaturization of packages and assemblies. Board assemblers who currently clean with a batch-type cleaner are looking for solutions to increase cleaning capability without moving to an in-line cleaner. The Electrovert® Aquastorm™ 50 batch cleaner utilizes cleaning technologies that are common to the Aquastorm in-line cleaners. The technology advantage of the Aquastorm 50 over other conventional batch type cleaners is the fluid delivery system. The Aquastorm 50 employs technologies that deliver dynamic direct impingement energy to board surfaces (sides A and B).

Within the semiconductor industry, key challenges facing manufacturers include the ability to remove oxidation from the surface of the strip/boards prior to wire-bonding, and the ability to remove contaminants from the board assembly (deflux and clean). The MicroCel™ batch cleaner employs centrifugal energy in an immersion wash environment. The MicroCel is compatible for solvent, semi-aqueous, and straight DI applications.

The Aquastorm 50 and MicroCel batch type cleaners are used in many cleaning applications:

  • PCB assembly;
  • De-fluxing;
  • Semiconductor manufacturing;
  • Smartphone and tablet electronics;
  • Microelectronics;
  • Hybrid electronics;
  • Misprint cleaning;
  • Industrial parts cleaning;
  • Wet cleaning prior to wire bonding;
  • Special cleaning applications.

Cleaning Machines:
Aquastorm 200 SST In-line PCB Cleaner | Aquastorm 200 In-line PCB Cleaner
Aquastorm 100 In-line PCB Cleaner Aquastorm 60 In-line PCB Cleaner
Aquastorm 50 Batch PCB Cleaner | ​Aquastorm FSM (Free Standing Module) PCB Cleaner
MicroCel Centrifugal Cleaner

In the semiconductor and electronics manufacturing industries, enhanced reliability continues to be a focus of manufacturers and cleaning is seen as a solution.

In the semiconductor and electronics manufacturing industries, enhanced reliability continues to be a focus of manufacturers and cleaning is seen as a solution.

As high reliability printed circuit boards become more dense and complex, PCB assemblers are seeking ways to enhance reliability. Cleaning is viewed as a process solution. Defluxing is the cleaning process designed to remove solder flux and by-products from the PCB assembly.

Drying is the process of removing any residual liquid from the surfaces of washed and rinsed parts. Drying is a critical and expensive stage of the cleaning process, especially for PCB assemblies. The importance of drying is determined by post-cleaning process step requirements.

Electrovert® offers a range of award-winning technologies, products, and features for a wide range of cleaning and drying applications.

In-line cleaning is a method of cleaning in which assemblies are processed continuously on a conveyor system and cleaning cycle times are controlled by the conveyor speed.

The Electrovert® Aquastorm™ series precision cleaning machines are designed to provide superior cleaning and drying performance, complete cleaning process flexibility and monitoring, all with unparalleled reliability.

As the value of double-sided PCB assemblies continue to rise, it becomes increasingly important for manufacturers to be able to recoup their cost from the assembly when a misprint occurs on the B-side (A-side was successfully printed and components placed and soldered, and when a misprint occurs during the printing process on the B-side).

The Electrovert® Aquastorm™ series precision cleaning machines are designed to provide superior cleaning and drying performance, complete cleaning process flexibility and monitoring, all with unparalleled reliability.

Electrovert® Aquastorm™ precision cleaning systems provide superior cleaning and drying performance, complete cleaning process flexibility, process monitoring, and reliability.