SMT Printing

MPM stencil printers pioneered Surface Mount Technology (SMT) solder paste printing and continue to lead the industry in performance and excellence in printing electronic materials, including SMT Solder Paste. Even though SMT printing is perennially demanding due to shrinking SMT PCB assembly configurations and demands for higher speed, throughput, and accuracy, MPM’s innovative team of engineers continue to meet these demands as technology evolves, even though these growing challenges have served to narrow the ‘process window’ for SMT printing. MPM printers, including the world-recognized Momentum series, have met customer demands with unmatched performance, reliability, and quality results, and continue to do so. MPM stencil printers are the global Gold Standard for delivering fast, accurate, and repeatable printing of electronic materials onto PCBs in the SMT assembly process.

Stencil Printing Machines:
Edison Stencil Printer | Momentum II Elite Stencil Printer | Momentum II HiE Stencil Printer  
Momentum II BTB Stencil Printer | Momentum II 100 Stencil Printer

MPM printers are high-speed, high-precision systems for depositing precise patterns of solder paste on printed circuit boards through foil stencils. Available in a wide range of capabilities.

Best-in-class printing performance has always been a hallmark of MPM printing technology, the recognized world standard for reliability, throughput, and high yields.

Traditional metal screens excel in the printing of many electronic materials on rigid and flexible PCBs. These materials include solder masks and resists, fluxes and solder pastes, and especially conductive inks (silver, carbon, silver chloride), and dielectric inks, both used to form conductive traces, capacitor and resistor elements.

Solder Paste printing, a complex mixture of tiny particles of solder alloy and flux vehicle, is a challenging material to print onto a bare Surface Mount Technology (SMT) PCB.

Stainless steel foil stencils are used to print solder paste and adhesives on bare PCBs. Stencils of varying thickness, and also ‘step’ stencils with varying thicknesses in specific areas for different deposition requirements are used.