Top Side Hole Filling

As the complexity of PCB assemblies continues to increase, many electronics assemblers are seeking a solution in a wave soldering system. The types of complexities encountered may include the following:

  • Need to increase topside hole fill on difficult-to-solder PCBs;

  • Multiple heavy ground planes with poor thermal relief;

  • High-mass multilayer PCBs;

  • Thick pallets;

  • Selective pallets;

  • OSP finishes on PCBs that have been double-sided reflowed;

  • Increased throughput in lead-free applications.

Electrovert has developed solutions to lead-free soldering issues in demanding production environments:

UltraFill™ Nozzle technology (patented)

  • Improves soldering results with lead-free alloys;

  • Nozzle placement increases wave contact time;

  • Increases hole fill and top-side fillets;

  • Reduced bridges or solder shorts via Lambda wave exit characteristics;

  • Easy switching between air and nitrogen environments

DwellMax™ Plus (patented):

  • Wide chip wave designed for difficult to solder assemblies;

  • Includes nitrogen tunnel over solder pot;

  • Nozzle design increases production throughput capability;

  • Nozzle design reduces defects and improves topside hole fill at faster conveyor speeds;

  • Significant cost savings through reduced dross and longer intervals between maintenance.

FloLift™ Technology:

  • Increases upward force of wave as the PCB is traveling over the wave;

  • Improves topside hole fill;

  • Software and recipe controlled.

Nitrogen Tunnel (Short and Full Tunnel)

  • Available with UltraFill nozzle;

  • Nitrogen tunnel standard with DwellMax Plus;

  • Significant cost savings through reduced dross and longer intervals between maintenance;

  • Improved wetting in nitrogen tunnel;

  • Available with an optional Oxygen analyzer;

  • Available as a field upgrade (check with the factory with serial # for configuration and compatibility verification).

Other Advantages of Electrovert Wave Soldering:

  • All new wave systems come with a lifetime warranty on the solder pot casting (applies to original owner).

  • Multiple preheat configurations available (all preheat types field upgradable)

  • Multiple fluxing configurations (ServoSpray™, ServoJet™, OA ServoJet™, ServoSonic™ and Foam Fluxer).


As board assemblies become increasingly complex and difficult to solder, board manufacturers are looking for wave solder machines that can provide closed-loop process control and automatic features.
Of the many flux products developed for soldering applications, most electronics assemblers prefer to use no-clean, low solids formulations, in part because they eliminate the post-reflow cleaning or defluxing process step.
In the demanding environment of lead-free soldering, it is important to understand the different characteristics of lead-free materials. Wetting times for lead-free alloys are slower than those of tin/lead, and flow characteristic are more viscous.
As PCB designs become more complex, thicker, and denser, through-hole soldering is becoming more difficult. The introduction of lead-free alloys compounds these problems because lead-free alloys don’t wet as well as lead-bearing alloys, and deeper holes (due to PCB thickness) make thorough hole-filling less certain in many cases.
Wave Soldering Award-winning wave soldering technologies have long met the demanding throughput and process control challenges of applications such as lead-free wave soldering.
Even though most SMT soldering is achieved through reflow, some assemblies require that some of the Surface Mounted Devices (SMDs) on a board, such as chip components, must be wave soldered.