ITW EAE’s assembly technology solutions are designed to excel in handling lead-free soldering technology. Lead-free alloys in solder paste typically have a tighter process window than traditional lead-bearing (e.g., SnPb) solders. They require higher temperatures for reflow and for wave soldering; they can also scavenge pump and solder pot parts in wave soldering systems. Lead-free alloys don't wet as well when soldering, which is why precise accuracy and process control is essential when printing, dispensing and soldering. MPM® printing and CAMALOT® dispensing accuracy, plus Electrovert® and Vitronic Soltec® process capabilities, and material compatibility assures the customer of success with lead-free alloy solders.