Electronic Assembly Printers
Momentum II 100 Stencil Printer
The Momentum II 100 stencil printer is flexible, configurable, and easy-to-use. With speed and accuracy unmatched by any other printer in its class, the Momentum II 100 offers the best of performance standards for high yields across a wide range of SMT PCB printing applications.
Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.
MPM’s new paste management system provides innovative tools to improve yield and enable Industry 4.0 traceability. The system includes an industry-first paste temperature monitor, measured for proper paste viscosity and a roll height monitor that now measures both upper and lower limits. All data can be recorded for board traceability. It’s a non-contact solution that can automatically add more paste.
New quick release squeegee blades make changing blades quick and easy with no tools required. It takes less than 30 seconds to change the blade. Momentum II offers an advanced print head featuring a high precision load cell with closed loop pressure control for precise and consistent squeegee force.
RapidClean is a high-speed stencil solvent cleaning innovation that slashes cycle time and improves stencil cleaning performance, especially for fine-pitch. RapidClean reduces 3 wipe strokes to 2 and cuts cycle time by 5 – 6 seconds per print cycle over the standard wiper; and because fewer cleaning cycles are required, RapidClean can save up to $10K USD per annum in paper savings per printer.
The SPI print optimizer communicates with the external Solder Paste Inpsection (SPI) system to continuously monitor and auto-correct X, Y and Theta registration on the fly to stay on target and precent print defects.
Overview
The Momentum® II 100 stencil printer is a hard-working, value-priced machine utilizing the robust, reliable Momentum series printer proven in top facilities around the world. Featuring a modest footprint that can grow with the user: add or retrofit innovative, patented features as throughput demands grow.
Featured Technology and Benefits
Alignment repeatability of ±11 microns @ 6 sigma, Cpk ≥2 and wet Print accuracy of 20µm@6σ, Cpk ≥ 2, with 6σ capability designed in and independently verified. The Momentum II series stencil printers are fast, precise, and highly reliable, with performance unmatched by any other printer in their class.
The Momentum II 100 is a space-saving 200 mm shorter than the standard Momentum II stencil printer platform. Configured for Back-to-Back (BTB) processing, for example, two individual printers back to back in a manufacturing line enables dual-lane processing with the combined output of two machines, but in the line length of one.
The Momentum II 100 is designed for total front-side accessibility for simplified service to the electrical system, access to the solvent reservoir, and more. Without the need for rear access space, adjacent BTB machines help you make the most of every inch of your floor space.
Accurate and repeatable performance delivers quality products with fewer defects. The reasonable cost of ownership for the Momentum II 100 printer ensures you'll see a faster ROI, and higher profitability going forward.
Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.
AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.
Provides the flexibility to handle all stencil sizes with a simple adjustment of the shelf. The robust design provides better stability on all stencil sizes.
Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.
BridgeVision is a patented method of analyzing bridge defects on circuit boards in the post-print inspection process. This innovative system utilizes texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.
StencilVision utilizes texturebased technology to check the underside of a stencil for solder paste contamination. Wiper operation can be driven by the results obtained.
MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.
MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.
The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.
Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.
PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.
New quick release squeegee blades make changing blades quick and easy with no tools required. It takes less than 30 seconds to change the blade.
RapidClean is a high-speed stencil solvent cleaning innovation that slashes cycle time and improves stencil cleaning performance. RapidClean can save up to $10K USD per nnum in paper savings per printer.
SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.