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MPM Edison II ACT (Automated Changeover Technology)

This innovative MPM patented Automated Changeover Technology (ACT) provides a simple, cost-effective and progressive solution toward the end goal for factory automation. 

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Sept. 4 - 6, 2024 Taipei, Taiwan
For most people the reflow process is like a black box where the Printed Circuit Board goes in, and it comes out with soldered connections. The reflow profile is a critical aspect of the soldering process. It defines the temperature and time

Technical Papers

Today’s unique assembly challenges are comprised of complex printed circuit board (PCB) panelization, involving identical PCBs with a goal of…