1. Applications
  2. Dispensing
  3. Underfill

Underfill

Underfill is used in a wide variety of packages and board-level assemblies, and Camalot® dispense machines, particularly the SmartStream® pump technology, perform fast, efficient, complete underfill for all types of packages reliably and repeatably. Underfill is dispensed and flowed under flip chips, direct chip attach on boards, stacked die packages, and various ball grid array (BGA) components where, once cured, stabilizes the component. 

 

 

Camalot Dispensing

DispensingFor decades, Camalot® has been the global leader in dispensing technology for electronic materials. From board-level assembly to advanced packaging to cutting-edge compound semiconductors, Camalot’s innovative solutions have kept our dispense systems solutions in the forefront.

Conductive Adhesives

Camalot® dispensing machines excel in the precise, highly accurate micro-dispensing of conductive adhesives and epoxy resins onto a variety of surfaces including silicon, silver, gold and copper.

Dam & Fill Encapsulation

Camalot® dispensing machines' ability to precisely dispense both materials at high speed using dual head technology delivers high throughput and efficiency in dam and fill applications. 

Edge/Corner Bonding

Camalot® precision dispense technology ensures successful application of adhesives for both corner and edge bonding processes. Edge and corner bonding are used as an alternative to underfill to add mechanical strength and reliability to BGAs and similar chip-scale packages (CSPs) and to increase reliability for drop testing.

Flux Applications

Selective automated flux dispensing is utilized at certain stages in the assembly process where improved reliability and speed are required. Many applications include rework.

RTV/Gasketing Applications

Camalot’s advanced time/pressure dispensing technology precisely and consistently applies curable RTV gasketing fluids for a wide range of applications such as automotive electronics and aerospace where a robust form-in-place (FIP) gasket is required to provide environmental isolation for electronic components and assemblies.

Solder Paste Dispensing

Camalot® dispensers incorporate the most advanced deposition technology for solder paste dispensing, traditionally one of the most difficult materials to dispense consistently.

Surface Mount Adhesives

Surface Mount Adhesives (SMA’s) are typically used to hold SMT components in place on the bottom side of a PCB. These can range from small ‘chip’ components to large devices. The adhesive, usually in highly visible yellow or red colors, is dispensed typically in dot form and is heat-curable.

Thermal Interface Materials

Thermal Interface Materials (TIMs) are often curable higher-viscosity fluids designed to conduct heat from one object to another. Typically, they are sandwiched between a heat-generating surface and the surface of a heat sink.

UV Selective Coating

UV-curable selective coatings can be precisely applied to critical areas of electronic components and assemblies using Camalot® dispense technology including SmartStream, a unique patented non-contact pump technology.