Underfill is used in a wide variety of packages and board-level assemblies, and Camalot® dispense machines, particularly the SmartStream® pump technology, perform fast, efficient, complete underfill for all types of packages reliably and repeatably. Underfill is dispensed and flowed under flip chips, direct chip attach on boards, stacked die packages, and various ball grid array (BGA) components where, once cured, stabilizes the component.