Lakeville, Minnesota, January 15, 2019 – ITW EAE, the Electronic Assembly Equipment division of ITW will be showcasing MPM, Camalot, Electrovert and Vitronics Soltec equipment at the IPC APEX Expo, January 29 - 31, 2019 in San Diego, California. The ITW EAE booth (3339) will have Engineers and Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.
ITW EAE has worked with the world’s leading manufacturers in developing equipment that addresses evolving technical challenges such as miniaturization while also meeting the need for higher throughput, yield and performance. Key interface solutions have been developed for Industry 4.0/MES that will lead to improvements in yield, data collection and overall equipment effectiveness.
“Rapid miniaturization is increasing demand for advances in speed and precision, and we are excited to showcase our strength in these areas,” said Pat O’Brien, ITW EAE Vice President and General Manager. “We also looking forward to continuing our discussions with leading manufacturers on our Industry 4.0 solutions and the collective advantages these capabilities can bring.
Electrovert will be introducing the DwellFlex 4.0 variable contact wave solder nozzle. The DwellFlex 4.0 is the first nozzle designed specifically with Industry 4.0 automation in mind. The patent-pending design enables the wave width to be adjusted on-the-fly as variable board types are run through the wave. This ensures solder contact time is optimized for a high-mix of board types without changing conveyor speeds.