Technical Papers

Miniaturization continues in all kind of electronic assemblies and thus also in the different soldering processes. Not only consumer electronic assemblies…

Selective soldering, along with pin-in-paste reflow and press fit, is the primary assembly method for through-hole components. The reflow process is limited by…

Flux is one of the most critical parameters in the selective soldering process. Flux deposition on the board needs to be carefully controlled. It should have…

In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of…

Three ingredients are required to make a good solder joint: solder, clean metal surfaces to connect and heat. In a selective soldering process all three have a…

Selective soldering is a process with more than one hundred different parameters that may impact soldering performance. Some conditions change over time, e.g.…

The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole)…

Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free…

One of the major trends in circuit board assembly is the drive to smaller components and pitches. Where the focus is on SMD (Surface Mount Devices) and also THT…

The number of through-hole components on printed circuit boards (PCB) has declined significantly over the last decade. Miniaturization in electronics has…

Although the number of Through Hole (THT) connections the electronics assemblies is decreasing due to miniaturization, selective soldering is still a growing…

An inert atmosphere opens the reflow process window. Reflow ovens that have a Nitrogen environment may have better yields because of the lack of oxidation…

The number of components and functionality on a printed circuit board increases continuously. SMD components become smaller, pitch dimensions shrink, but there…