Lakeville, Minnesota, January 23, 2020 – ITW EAE, the Electronic Assembly Equipment division of ITW will be showcasing its latest developments at IPC APEX Expo, February 4-6, 2020 in San Diego. The ITW EAE booth 813 will have MPM, Camalot, Electrovert and Vitronics Soltec Engineers and Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.
MPM will be launching the new Momentum II Elite with a new paste monitoring system featuring temperature monitoring as well as upper and lower limit roll-height monitoring. These new features will improve yield and reduce waste by ensuring proper paste viscosity to avoid bridging and voiding and eliminate insufficient or excess paste volumes. There is also a new user-friendly graphic user interface.
MPM will also have the Momentum II BTB on display for a preview of its release.
Camalot will be featuring the new 50-inch dual lane Prodigy dispenser. The dual lane conveyor design allows up to six heat zones which is crucial for underfill applications that require pre and post heat and has a large (400mm x 254mm) capacity. Camalot will also showcase new IR (Infrared) Temperature Sensors. Patent-pending, closed-loop monitoring of the PCB/substrate temperature ensures dispenser process stability and yield improvements for underfill applications.
Electrovert will be demonstrating the new DwellFlex 4.0 variable contact wave solder nozzle. The DwellFlex 4.0 is the first nozzle designed specifically with Industry 4.0 automation in mind. The patent-pending design enables the wave width to be adjusted on-the-fly as variable board types are run through the wave. This ensures solder contact time is optimized for a high-mix of board types without changing conveyor speeds.
Vitronics Soltec will showcase the improved performance of the ZEVAm+ Selective Soldering system with live soldering demonstrations every hour. The ZEVAm+ excels at fine pitch soldering with its ability to solder at an angle and the innovative SDC debridging tool. The Centurion Reflow Soldering System will feature several new options including True N2 to Air Switching, fast cool down for high-mix applications and a new air flow system designed to extract flux contamination out of air environment systems.
ITW EAE has worked with the world’s leading manufacturers in developing equipment that addresses evolving technical challenges such as miniaturization while also meeting the need for higher throughput, yield and performance. Key interface solutions have been developed for Industry 4.0/MES that will lead to improvements in yield, data collection and overall equipment effectiveness.