Webinar Description - In this webinar the key differences between vacuum reflow and traditional convection reflow are emphasized.  Convection reflow uses heated gas to melt solder paste. It's widely used and cost-effective. Vacuum reflow adds a vacuum phase after peak reflow to remove trapped gasses especially reducing voids. The impact on thermal profiles, and solder joint reliability are discussed. When choose each method for optimal performance in high-reliability electronics. Perfect for process engineers, quality managers, and anyone involved in SMD production.

Presenter bio – Gerjan Diepstraten

Advanced Technology Manager at ITW EAE Vitronics Soltec. Responsible for soldering processes and new technology developments with over 30 years’ experience. Six Sigma Black Belt trained at University of Amsterdam. Learned about solder materials when working for Cobar Europe B.V. Received a 'Honorable Mention’ for IPC Technical Conference Paper presented at APEX Expo, Las Vegas 2009. Published over 50 articles in technical magazines and is an IPC-A-610 Certified Trainer. Presented technical research papers of over the world and owns several worldwide patents for soldering applications.

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October 16, 2025 @ 9:00am EST - Click here to register