Reflow Soldering of PCB Components with Mixed Thermal Mass
Growth of electrical vehicles and 5G technologies may impact the landscape of soldering equipment used for printed circuit board (PCB) assemblies. These applications require large multi-layer PCBs that contain small surface mounted devices (SMD) together with heavy transformers and capacitors. This mismatch of thermal mass creates challenges for reflow process and specifically for convection ovens. Large or heavy components usually require long total heating time which may cause small components to overheat.
Centurion Reflow Idle Mode
Centurion Reflow Oven features the Idle Mode option that reduces power consumption and nitrogen consumption when machine is idle. With different settings for different production needs, idle mode option saves up to 35% power and 40% of nitrogen.
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Centurion+ Reflow Oven - Product Brochure - Chinese
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Bridge Prevention Technology
This patented tool acts as a hot nitrogen knife to prevent bridging for small pitch up to 1mm (40mil) pin to pin distance even with longer leads and increased drag speed.