Electronic Assembly Printers

Momentum II 100 Stencil Printer

Submitted by admin on Fri, 12/24/2021 - 19:53

The Momentum® II 100 stencil printer is a hard-working, value-priced machine utilizing the robust, reliable Momentum series printer proven in top facilities around the world. Featuring a modest footprint that can grow with the user: add or retrofit innovative, patented features as throughput demands grow.

Momentum II BTB Stencil Printer

Submitted by admin on Fri, 12/24/2021 - 19:14

Momentum® II BTB features a smaller footprint than the standard Momentum platform. Back-to-Back configuration allows dual lane processing for higher throughput without increasing line length or capital investment. Dual lane provides the flexibility to print multiple products in a single SMT line, such as top and bottom side, same side, or mother/ daughter boards making the BTB the most flexible model in the proven Momentum platform.

MPM Stencil Printer

MPM printers are engineered with proven technology that was built on our successful legacy MPM stencil printer machines. From new print head technology to vision system development, today's leading Momentum series of stencil printers are ready to meet the most exacting manufacturing challenges.

Solder Paste Printing

Submitted by admin on Sun, 12/12/2021 - 01:17

Solder Paste printing, a complex mixture of tiny particles of solder alloy and flux vehicle, is a challenging material to print onto a bare Surface Mount Technology (SMT) PCB. Solder paste printed deposits are essential to forming defect-free solder joints, the electrical and physical connections between electronic components and the PCB assembly. MPM printers excel in printing crisp, accurate, defect-free deposits of solder paste through metal foil stencils onto PCBs with consistent results every time, shift after shift, board after board, with precise, repeatable results.

SMT Printing

Submitted by admin on Sun, 12/12/2021 - 01:10

MPM stencil printers pioneered Surface Mount Technology (SMT) solder paste printing and continue to lead the industry in performance and excellence in printing electronic materials, including SMT Solder Paste. Even though SMT printing is perennially demanding due to shrinking SMT PCB assembly configurations and demands for higher speed, throughput, and accuracy, MPM’s innovative team of engineers continue to meet these demands as technology evolves, even though these growing challenges have served to narrow the ‘process window’ for SMT printing.

Screen Printing

Submitted by admin on Fri, 12/10/2021 - 01:50

Traditional metal screens excel in the printing of many electronic materials on rigid and flexible PCBs. These materials include solder masks and resists, fluxes and solder pastes, and especially conductive inks (silver, carbon, silver chloride), and dielectric inks, both used to form conductive traces, capacitor and resistor elements. Once cured, these materials form the basis for electronic assemblies used in medical/biomedical, sensor, membrane touch switch, flexible display, and many other types of products including consumer electronics.

SECS/GEM Communication Package Announced for MPM Edison Stencil Printer

Submitted by admin on Wed, 12/08/2021 - 13:48

Lakeville, Minnesota, January 26, 2021 – ITW EAE announces a new SECS/GEM communication package for the MPM® Edison™ Printer. SECS/GEM is a semiconductor market communication standard that provides a common interface between manufacturing equipment. The Edison package collects and logs process data which can be used to optimize the production line. 

MPM Announces New EdgeLoc Board Clamping and Board Staging Options for Edison Printers

Submitted by admin on Tue, 12/07/2021 - 20:13

Lakeville, Minnesota, October 29, 2019 – ITW EAE is announcing new features for the MPM® Edison™ Printer. Board staging, designed to meet the demands from Automotive manufacturers for reduced cycle time, will now be a feature on the Edison. And the new EdgeLoc™ II is a robust addition to the
side-clamming capability on the Edison.