Solder Paste printing, a complex mixture of tiny particles of solder alloy and flux vehicle, is a challenging material to print onto a bare Surface Mount Technology (SMT) PCB. Solder paste printed deposits are essential to forming defect-free solder joints, the electrical and physical connections between electronic components and the PCB assembly. MPM printers excel in printing crisp, accurate, defect-free deposits of solder paste through metal foil stencils onto PCBs with consistent results every time, shift after shift, board after board, with precise, repeatable results.

MPM stencil printers pioneered Surface Mount Technology (SMT) solder paste printing and continue to lead the industry in performance and excellence in printing electronic materials, including SMT Solder Paste. Even though SMT printing is perennially demanding due to shrinking SMT PCB assembly configurations and demands for higher speed, throughput, and accuracy, MPM’s innovative team of engineers continue to meet these demands as technology evolves, even though these growing challenges have served to narrow the ‘process window’ for SMT printing.

Traditional metal screens excel in the printing of many electronic materials on rigid and flexible PCBs. These materials include solder masks and resists, fluxes and solder pastes, and especially conductive inks (silver, carbon, silver chloride), and dielectric inks, both used to form conductive traces, capacitor and resistor elements. Once cured, these materials form the basis for electronic assemblies used in medical/biomedical, sensor, membrane touch switch, flexible display, and many other types of products including consumer electronics.