Advances in Fine Pitch Printing Process Technology

Abstract

Increasingly fine pitch component patterns on PCBs, and ever-smaller passive components such as 03015’s continue to narrow the process window for PCB assemblers. The drive toward ever-finer pitches is driven by a number of factors, particularly miniaturization in mobile devices such as Smartphones, where consumers are demanding greater functionality in compact, hand-held devices. As a result, material handling and component placement becomes more difficult, and solder paste printing is especially impacted.

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