News and Events
Join us and experience ITW EAE solutions and innovation first-hand at these important industry trade shows, symposiums, and events:
Vitronics Soltec Introduces Centurion+ for High Solder Paste Reflow Applications
Vitronics Soltec is releasing a new reflow soldering oven that addresses the unique challenges facing high solder paste customers. The new Centurion+ is a robust upgrade to the proven Centurion with unique features that further minimize maintenance and keep the process chamber cleaner.
Electrovert® Introduces Lower Priced Alternative to Stainless Steel for High Temperature in-line Cleaning
ITW EAE is releasing a new high-temperature polypropylene option for the Electrovert Aquastorm 200. The heat stabilized polypropylene material is able to withstand operating water temperatures up to 180ᵒF (82ᵒC). All plumbing and spray nozzles remain stainless steel with orbital welds to eliminate pressure drops and leaks. Plumbing sections have quick-disconnect fittings for easy maintenance.
ITW EAE Wins New Product Introduction Award for Camalot Tilt and Rotate Dispenser Technology
Hopkinton, Massachusetts, January 24, 2023 – ITW EAE is proud to announce that it has earned a 2023 New Product Introduction (NPI) Award for Camalot’s Tilt and Rotate dispensing technology. This new, innovative system reduces wet out areas, improves capillary flow for underfill and provides access to dispense on side walls, underneath, or around tall components.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Auto Exit Wing
Camdenton, Missouri, January 24, 2023 – ITW EAE is proud to announce that it has earned a 2023 New Product Introduction (NPI) Award for Electrovert’s Auto Exit Wing technology for wave soldering machines. This new, innovative system provides automatic adjustment of the laminar wave flow to match the board velocity.
ITW EAE to Showcase Latest Electronic Assembly Equipment Developments at IPC APEX
Lakeville, Minnesota, December 13, 2022 – ITW EAE will be showcasing its latest developments at IPC APEX, January 24-26 in San Diego. The ITW EAE booth #1106 will have MPM, Camalot, Electrovert and Vitronics Soltec Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.
ITW EAE Introduces Auto Exit Wing Feature for Electrovert® Wave Soldering Machines
Camdenton, Missouri, November 15, 2022 – ITW EAE is releasing a new feature for the Electrovert Wave Soldering machines that provides automatic adjustment of the laminar wave flow to match the board velocity. To fully optimize the flow dynamics of the laminar wave, the velocity of the PCB needs to equal the flow of the solder over the weir of the exit wing.
ITW EAE Introduces Syringe Cooling Option for Camalot Prodigy Dispenser to Extend Underfill Material Life
Hopkinton, Massachusetts, November 1, 2022 – ITW EAE is releasing a proprietary syringe cooling option that increases the “pot-life” of underfill materials by maintaining the syringe at controlled temperature within the heated machine environment.
ITW EAE to Showcase Latest Semiconductor Packaging Equipment Developments at Semicon Taiwan
ITW EAE will be showcasing its latest developments at Semicon Taiwan, September 14-16 at Taipei World Trade Center.
Despatch Celebrates the 120th Anniversary with 200,000 Sales Milestone
Minneapolis, Minnesota, USA, August 19, 2022 – Despatch is celebrating 120 years in business this year. The anniversary coincides with another significant milestone, the sale of 200,000 units.
ITW EAE Granted Patent No. 10,780,516 for Electrovert® DwellFlex™ 4.0 Variable Contact Wave Solder Nozzle
Camdenton, Missouri, June 14, 2022 – The U.S. Patent and Trademark Office has issued Patent No. 10,780,516 protecting Electrovert’s DwellFlex 4.0 Variable Contact Wave Solder Nozzle. Invented by ITW EAE engineers, John Dautenhahn and Greg Hueste, the DwellFlex 4.0 is the first nozzle that allows the wave width to be adjusted on-the-fly variable board types are run through the wave. This ensures solder contact time is optimized for a high mix of board types without losing production time to change conveyor speeds.