AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

Auotmatic Paste Dispenser - Brochure

The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.

This innovative system uses  texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

• Finds bridging defects post-print – before they go to reflow
• Patented contrast and texture-based technologies
• Combines with SPC tools

The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.

The EnclosedFlow print head offers significant process and cost advantages over printing with metal squeegee blades, particularly for fine-feature printing. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.

The EnclosedFlow print head delivers superior volume/yield on fine pitch pads. Print fine pitch features such as 01005s and 0.3 mm pitch CSPs with up to 50% greater volume and 25% lower deviation that squeegee blades. The EnclosedFlow print head ensures optimal aperture filling for fine pitch devices and crisp uniform printing with less waste.

EnclosedFlow - Brochure and FAQs

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

MPM’s patented printer based Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Height Monitor - Brochure

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

Paste Temperature Monitor - Brochure

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

SPI Print Optimizer - Brochure

The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.

The StencilVision system:

• Detects solder paste seepage from apertures to stencil underside
• Initiates underside stencil wiping sequence to remove contamination
• Prevents print defects, contamination of PCB caused by dirty stencil underside
• Efficient – initiates wiping only when needed

Ensures optimum stencil to board gasketing