Technical Papers

Increasingly fine pitch component patterns on PCBs, and ever-smaller passive components such as 03015’s continue to narrow the process window for PCB assemblers…

Stencil printing is a critical first step in surface mount assembly. It is often cited that the solder paste printing operation causes about 50%-80% of the…

Stencil printing technology has come a long way since the early 80’s when SMT process gained importance in the electronics packaging industry. In those early…

Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing…

Paste-in-Hole (PIH) printing, a.k.a. through-hole printing, pin-in-paste, intrusive reflow, etc., has always been a way to accommodate traditional through-hole…

Stencil printing today requires a higher degree of printer accuracy than ever before. Printer accuracy becomes increasingly difficult to maintain as demands for…

Process traceability and verification has become increasingly important as electronics assembly has moved to higher throughputs and volume requirements with…

In simplest terms, a faster printer logically means higher throughput. Overall speed, however, is dependent upon a number of factors including the individual…

The techniques described have proven to be robust and particularly well suited for detecting troublesome bridge and bridge-like features that span the gap…

This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components…

Under stencil wiping is the first defense against defects. Matching the wiper profile and frequency to the individual boards, where one size does not fit all.…