Underfill is used in a wide variety of packages and board-level assemblies, and Camalot® dispense machines, particularly the SmartStream® pump technology, perform fast, efficient, complete underfill for all types of packages reliably and repeatably. Underfill is dispensed and flowed under flip chips, direct chip attach on boards, stacked die packages, and various ball grid array (BGA) components where, once cured, stabilizes the component. 

Thermal Interface Materials (TIMs) are often curable higher-viscosity fluids designed to conduct heat from one object to another. Typically, they are sandwiched between a heat-generating surface and the surface of a heat sink. TIMs are often dispensed in patterns, which can be in the shape of a cross, star, or serpentine. Camalot® precision dispensing and auger pump technology ensure controlled, consistent dispensing of dots, lines, and patterns as required.

Surface Mount Adhesives (SMA’s) are typically used to hold SMT components in place on the bottom side of a PCB. These can range from small ‘chip’ components to large devices. The adhesive, usually in highly visible yellow or red colors, is dispensed typically in dot form and is heat-curable. Dispensing equipment must be able to dispense precise, consistent dot shapes with different volumes as required for a wide variety of device sizes.