Camalot® dispensers incorporate the most advanced deposition technology for solder paste dispensing, traditionally one of the most difficult materials to dispense consistently. Our products are engineered to dispense precise dots or patterns of paste board after board and shift after shift using innovative material-handling designs that minimize dispense problems associated with paste, including separation. Separation can cause clogging, resulting in significant dispensing machine down time and high rework costs.

Camalot’s advanced time/pressure dispensing technology precisely and consistently applies curable RTV gasketing fluids for a wide range of applications such as automotive electronics and aerospace where a robust form-in-place (FIP) gasket is required to provide environmental isolation for electronic components and assemblies. Silicone RTV fluids are typically very fast UV-curable materials that are also high in viscosity.

Selective automated flux dispensing is utilized at certain stages in the assembly process where improved reliability and speed are required. Many applications include rework. Precision dot dispensing allows very tightly controlled volumes of flux to be accurately targeted to specific areas, thus preventing excess fluxing, which can result in cleaning issues or flowing and spreading to undesired areas.

Camalot® precision dispense technology ensures successful application of adhesives for both corner/edge bonding processes. Edge/corner bonding is used as an alternative to underfill to add mechanical strength and reliability to BGAs and similar chip-scale packages (CSPs) and to increase reliability for drop testing. Corner/edge bonding is dispensed post-reflow and cured with an additional process (oven).

Camalot® dispensing machines’ ability to precisely dispense both materials at high speed using dual head technology delivers high throughput and efficiency in dam and fill applications. Dam and fill is a method of fully encapsulating wire bonded die. It’s a two-part process, wherein a dam is dispensed first around the periphery of the top of the component, followed by filling the center.

Camalot® dispensing machines excel in the precise, highly accurate micro-dispensing of conductive adhesives and epoxy resins onto a variety of surfaces including silicon, silver, gold and copper. Conductive adhesives (usually heat-curable thermosets) are used to attach bare dies and other components to the substrate, e.g., ceramics, LTCCs, lead frames, flex circuits, LED assembly, and more. They are also used in semiconductor attachment and flip chip advanced packaging applications.

For decades, Camalot® has been the global leader in dispensing technology for electronic materials. From board-level assembly to advanced packaging to cutting-edge compound semiconductors, Camalot’s innovative solutions have kept our dispense systems solutions in the forefront.