MPM Printers Features
Momentum II BTB Stencil Printer
AccuCheck Print Capability Verification
AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.
Automatic Paste Dispensing System
Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.
Benchmark User Interface
Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.
The BridgeVision™ system is a patented method of analyzing bridge defects on circuit boards during the post-print inspection process.
This innovative system uses texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.
- Finds bridging defects post-print – before they go to reflow
- Patented contrast and texture-based technologies
- Combines with SPC tools
The BridgeVision system operates simultaneously with the MPM 2D paste inspection system.
EdgeLoc Board Clamping System
The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.
EnclosedFlow Print Head
The MPM EnclosedFlow Print Head delivers uniform aperture filling and superb printing performance especially for fine pitch devices, with tremendous savings on solder paste over squeegee blade printing – in excess of 50% over blades for dramatically fast ROI. Printing fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than metal blades.
MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.
MPM Vision System & Inspection
MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.
Paste Height Monitor
The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.
Paste Temperature Monitor
Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.
PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.
RapidClean Stencil Cleaner
RapidClean is a high speed stencil solvent cleaning innovation that slashes cycle time and improves stencil cleaning performance, especially for fine-pitch. RapidClean reduces 3 wipe strokes to 2 and cuts cycle time by 5 – 6 seconds per print cycle over the standard wiper; and because fewer cleaning cycles are required, RapidClean can save up to $10K USD per annum in paper savings per printer.
SPI Print Optimizer
SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.
The StencilVision™ system uses texture-based technology and a digital camera system to check the underside of a stencil for solder paste contamination. The results of the check drive wiper operation.
The StencilVision system:
- Detects solder paste seepage from apertures to stencil underside
- Initiates underside stencil wiping sequence to remove contamination
- Prevents print defects, contamination of PCB caused by dirty stencil underside
- Efficient – initiates wiping only when needed
Ensures optimum stencil to board gasketing